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BS EN IEC 60539-1:2023 - TC Tracked Changes. Directly heated negative temperature coefficient thermistors - Generic specification, 2023
- 30469780
- A-30411012 [Go to Page]
- undefined [Go to Page]
- Annex A (normative)Normative references to international publicationswith their corresponding European publications
- Blank Page
- English [Go to Page]
- CONTENTS
- FOREWORD
- 1 Scope
- 2 Normative references
- 3 Terms and definitions
- Figures [Go to Page]
- Figure 1 – Typical resistance-temperature characteristic for NTC thermistors
- Figure 2 – Decreased power dissipation curve
- Figure 3 – Maximum current derating
- 4 General items [Go to Page]
- 4.1 Units and symbols
- 4.2 Preferred values and appropriate category [Go to Page]
- 4.2.1 General
- 4.2.2 Appropriate category
- 4.3 Marking [Go to Page]
- 4.3.1 General
- Tables [Go to Page]
- Table 1 – Lower and upper category temperatures and duration ofthe damp heat, steady state test [Go to Page]
- 4.3.2 Marking for small size types such as surface mount NTC thermistors
- 4.3.3 Coding
- 4.4 Quality assessment procedures
- 5 General provisions for measurements and test methods [Go to Page]
- 5.1 General
- 5.2 Standard atmospheric conditions for testing
- 5.3 Drying and recovery [Go to Page]
- 5.3.1 Drying
- 5.3.2 Recovery
- 5.4 Mounting (for surface mount thermistors only) [Go to Page]
- 5.4.1 General
- 5.4.2 Printed wiring board and land pattern
- 5.4.3 Mounting on board
- 6 Electrical tests and measurements [Go to Page]
- 6.1 Zero-power resistance [Go to Page]
- 6.1.1 General
- 6.1.2 Measurement procedures
- 6.1.3 Requirements
- 6.2 B-value or resistance ratio [Go to Page]
- 6.2.1 General
- 6.2.2 Requirements
- Figure 4 – Basic circuit for zero-power resistance measurement
- 6.3 Insulation resistance (for insulated types only) [Go to Page]
- 6.3.1 General
- 6.3.2 Test methods
- Figure 5 – Example of Method 1 for testing the insulation resistance
- Figure 6 – Example of Method 2 for testing the insulation resistance (1)
- Figure 7 – Example of Method 2 for testing the insulation resistance (2)
- Figure 8 – Example of Method 3 for testing the insulation resistance
- Figure 9 – Example of Method 4 for testing the insulation resistance [Go to Page]
- 6.3.3 Applied voltage
- 6.3.4 Requirements
- 6.4 Voltage proof (for insulated types only) [Go to Page]
- 6.4.1 General
- 6.4.2 Test voltage
- 6.4.3 Requirements
- 6.5 Resistance/temperature characteristic [Go to Page]
- 6.5.1 General
- 6.5.2 Test methods
- 6.5.3 Requirements
- 6.6 Dissipation factor (δ) [Go to Page]
- 6.6.1 General
- 6.6.2 Initial measurements
- 6.6.3 Test methods
- Figure 10 – Example of test chamber [Go to Page]
- 6.6.4 Requirements
- 6.7 Thermal time constant by ambient temperature change (τa) [Go to Page]
- 6.7.1 The hot to cold thermal time constant for ambient temperature change
- Figure 11 – Dissipation factor measuring circuit [Go to Page]
- 6.7.2 The cold to hot thermal time constant for ambient temperature change
- 6.7.3 Final measurements and requirements
- 6.7.4 Requirements
- 6.8 Thermal time constant by cooling after self-heating (τc) [Go to Page]
- 6.8.1 General
- 6.8.2 Initial measurements
- 6.8.3 Preconditioning
- 6.8.4 Test method
- 6.8.5 Final measurements and requirements
- 7 Mechanical test and measurements [Go to Page]
- 7.1 Visual examination and check of dimensions [Go to Page]
- 7.1.1 Visual examination
- Figure 12 – Thermal time constant measuring circuit [Go to Page]
- 7.1.2 Dimensions
- 7.2 Robustness of terminations (not applicable to surface mount thermistors) [Go to Page]
- 7.2.1 General
- 7.2.2 Initial measurements
- 7.2.3 Test methods
- 7.2.4 Test Ua1 – Tensile
- 7.2.5 Test Ub – Bending (half the number of terminations)
- 7.2.6 Test Uc – Torsion (remaining terminations)
- 7.2.7 Final measurements and requirements
- 7.3 Vibration [Go to Page]
- 7.3.1 General
- 7.3.2 Initial measurements
- 7.3.3 Test procedures
- Table 2 – Tensile force [Go to Page]
- 7.3.4 Final inspection, measurements and requirements
- 7.4 Shock [Go to Page]
- 7.4.1 General
- 7.4.2 Initial measurements
- 7.4.3 Mounting
- 7.4.4 Test procedures
- 7.4.5 Final inspection, measurements and requirements
- 7.5 Free fall [Go to Page]
- 7.5.1 General
- 7.5.2 Initial measurements
- 7.5.3 Test procedures
- 7.5.4 Final inspection, measurements and requirements
- 7.6 Shear (adhesion) test (for surface mount NTC thermistors only) [Go to Page]
- 7.6.1 General
- 7.6.2 Initial measurements
- 7.6.3 Test conditions
- 7.6.4 Final inspection, measurements and requirements
- 7.7 Substrate bending test (for surface mount NTC thermistors only) [Go to Page]
- 7.7.1 General
- 7.7.2 Initial measurements
- 7.7.3 Test procedures
- 7.7.4 Final inspection, measurements and requirements
- 8 Environmental and climatic tests [Go to Page]
- 8.1 Rapid change of temperature [Go to Page]
- 8.1.1 General
- 8.1.2 Initial measurements
- 8.1.3 Test procedures
- 8.1.4 Final inspection, measurements and requirements
- 8.2 Thermal shock [Go to Page]
- 8.2.1 General
- 8.2.2 Initial measurements
- 8.2.3 Test procedures
- 8.2.4 Final inspection, measurements and requirements
- 8.3 Cold [Go to Page]
- 8.3.1 General
- 8.3.2 Initial measurements
- 8.3.3 Test procedures
- 8.3.4 Final inspection, measurements and requirements
- 8.4 Dry heat [Go to Page]
- 8.4.1 General
- 8.4.2 Initial measurements
- 8.4.3 Test procedures
- 8.4.4 Final inspection, measurements and requirements
- 8.5 Damp heat, steady state [Go to Page]
- 8.5.1 General
- 8.5.2 Initial measurements
- 8.5.3 Test procedures
- 8.5.4 Recovery
- 8.5.5 Final inspection, measurements and requirements
- 8.6 Endurance [Go to Page]
- 8.6.1 General
- 8.6.2 Endurance at room temperature with applied continuous maximum current (Imax25) (for inrush current-limiting thermistors only)
- Figure 13 – Endurance at room temperature with Imax25 evaluating circuit [Go to Page]
- 8.6.3 Endurance at room temperature with applied cyclic maximum current (Imax25) (for inrush current-limiting thermistors only)
- Figure 14 – Endurance at room temperature with Imax25 evaluating circuit [Go to Page]
- 8.6.4 Endurance at T3 and Pmax (for other than inrush current-limiting thermistors only)
- 8.6.5 Endurance at upper category temperature
- 8.6.6 Maximum permissible capacitance (for inrush current-limiting thermistors only)
- Figure 15 – Maximum permissible capacitance test circuit (Method 1)
- Figure 16 – Maximum permissible capacitance test circuit (Method 2)
- 8.7 Salt mist [Go to Page]
- 8.7.1 General
- 8.7.2 Initial measurements
- 8.7.3 Test conditions
- 8.7.4 Final inspection, measurements and requirements
- 8.8 Sealing
- 8.9 Composite temperature/humidity cycle [Go to Page]
- 8.9.1 General
- 8.9.2 Initial measurements
- 8.9.3 Test conditions
- 8.9.4 Final inspection, measurements and requirements
- 9 Tests related to component assembly [Go to Page]
- 9.1 Resistance to soldering heat [Go to Page]
- 9.1.1 General
- 9.1.2 Preconditioning
- 9.1.3 Initial measurements
- 9.1.4 Test procedure
- 9.1.5 Recovery
- 9.1.6 Final inspection, measurement and requirements
- 9.2 Solderability [Go to Page]
- 9.2.1 General
- 9.2.2 Initial measurements
- 9.2.3 Test procedure
- 9.2.4 Final inspection, measurements and requirements
- 9.3 Component solvent resistance [Go to Page]
- 9.3.1 General
- 9.3.2 Initial measurements
- 9.3.3 Test conditions
- 9.3.4 Requirements
- 9.4 Solvent resistance of marking [Go to Page]
- 9.4.1 General
- 9.4.2 Initial measurements
- 9.4.3 Test conditions
- 9.4.4 Requirements
- Annex A (normative)Rules for the preparation of detail specifications fordirectly heated NTC thermistors for electronic equipment foruse within quality assessment systems [Go to Page]
- A.1 Drafting
- A.2 Reference standard
- A.3 Circulation
- Annex B (informative)Typical examples of mountings for measurementsof directly heated thermistors [Go to Page]
- Table B.1 – Recommended land dimensions
- Figure B.1 – Mounting for measurements of surface mount thermistors
- Annex Q (informative)Quality assessment procedures [Go to Page]
- Q.1 General [Go to Page]
- Q.1.1 Scope of this annex
- Q.1.2 Quality assessment definitions
- Q.1.3 Rework
- Q.1.4 Alternative test methods
- Q.1.5 Certified test records of released lots
- Q.1.6 Unchecked parameters
- Q.1.7 Delayed delivery
- Q.1.8 Repair
- Q.1.9 Registration of approvals
- Q.1.10 Manufacture outside the geographical limits
- Q.2 Qualification approval (QA) procedures [Go to Page]
- Q.2.1 Eligibility for qualification approval
- Q.2.2 Application for qualification approval
- Q.2.3 Subcontracting
- Q.2.4 Test procedure for the initial product qualification approval
- Q.2.5 Granting of qualification approval
- Q.2.6 Maintenance of qualification approval
- Q.2.7 Quality conformance inspection
- Q.3 Capability approval (CA) procedures [Go to Page]
- Q.3.1 General
- Q.3.2 Eligibility for capability approval
- Q.3.3 Application for capability approval
- Q.3.4 Subcontracting
- Q.3.5 Description of the capability
- Q.3.6 Demonstration and verification of capability
- Q.3.7 Granting of capability approval
- Q.3.8 Maintenance of capability approval
- Q.3.9 Quality conformance inspection
- Q.4 Technology approval (TA) procedure [Go to Page]
- Q.4.1 General
- Q.4.2 Eligibility for technology approval
- Q.4.3 Application of technology approval
- Q.4.4 Subcontracting
- Q.4.5 Description of technology
- Q.4.6 Demonstration and verification of the technology
- Q.4.7 Granting of technology approval
- Q.4.8 Maintenance of technology approval
- Q.4.9 Quality conformance inspection
- Q.5 Interpretation of sampling plans and procedures as described in IEC 60410 for use within quality assessment systems
- Q.6 Rules for the preparation of detail specifications for NTC thermistors for electronic equipment for use within quality assessment systems [Go to Page]
- Q.6.1 Drafting
- Q.6.2 Reference standard
- Q.7 Layout of the first page of a PCP/CQC specification
- Q.8 Requirements for capability approval test report [Go to Page]
- Q.8.1 General
- Q.8.2 Requirements
- Q.8.3 Summary of test information (for each CQC)
- Q.8.4 Measurement record
- Q.9 Guidance for the extension of endurance tests on fixed thermistor [Go to Page]
- Q.9.1 Overview
- Q.9.2 Guidelines
- Annex X (informative)Cross-references to IEC 60539-1:2016
- Bibliography [Go to Page]