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eLibrary > BS EN IEC 61249-2-45:2018 Materials for printed boards and other interconnecting structures - Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.0W/m K) and defi >

BS EN IEC 61249-2-45:2018 Materials for printed boards and other interconnecting structures - Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.0W/m K) and defi, 2018

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BS EN IEC 61249-2-45:2018 Materials for printed boards and other interconnecting structures - Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.0W/m K) and defi, 2018

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CONTENTS
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Materials and construction [Go to Page]
4.1 General
4.2 Resin system
4.3 Metal foil
4.4 Reinforcement
5 Electrical properties
Tables [Go to Page]
Table 1 – Electrical properties
6 Non-electrical properties of the copper-clad laminate [Go to Page]
6.1 Appearance of the copper-clad sheet [Go to Page]
6.1.1 General
6.1.2 Indentations (pits and dents)
6.1.3 Wrinkles
6.1.4 Scratches
Table 2 – Size of indentations [Go to Page]
6.1.5 Raised areas
6.2 Appearance of the unclad face
6.3 Laminate thickness
6.4 Bow and twist
Table 3 – Nominal thickness and tolerance of metal-clad laminate
6.5 Properties related to the copper foil bond
Table 4 – Bow and twist requirements
Table 5 – Pull-off and peel strength requirements
6.6 Punching and machining
6.7 Dimensional stability
6.8 Sheet sizes [Go to Page]
6.8.1 Typical sheet sizes
6.8.2 Tolerances for sheet sizes
Table 6 – Dimensional stability
6.9 Cut panels [Go to Page]
6.9.1 Cut panel sizes
6.9.2 Size tolerances for cut panels
6.9.3 Rectangularity of cut panels
6.10 Thermal conductivity
Table 7 – Size tolerances for cut panels
Table 8 – Rectangularity of cut panels
Table 9 – Thermal conductivity
7 Non-electrical properties of the base material after complete removal of the copper foil [Go to Page]
7.1 Appearance of the dielectric base material
7.2 Flexural strength
7.3 Flammability
Table 10 – Flexural strength requirements
7.4 Water absorption
7.5 Measling
7.6 Glass transition temperature and cure factor
Table 11 – Flammability requirements
Table 12 – Water absorption requirements
Table 13 – Measling requirements
7.7 Decomposition temperature
7.8 Time to delamination (TMA)
7.9 Halogen content
8 Quality assurance [Go to Page]
8.1 Quality system
Table 14 – Glass transition temperature and cure factor requirements
Table 15 – Decomposition temperature requirements
Table 16 – Time to delamination requirements
Table 17 – Halogen content
8.2 Responsibility for inspection
8.3 Qualification inspection
8.4 Quality conformance inspection
8.5 Certificate of conformance
8.6 Safety data sheet
9 Packaging and marking
10 Ordering information
Annex A (informative) Engineering information [Go to Page]
A.1 General
A.2 Chemical properties
A.3 Electrical properties
A.4 Flammability properties
A.5 Mechanical properties
A.6 Physical properties
A.7 Thermal properties
Annex B (informative) Common laminate constructions
Annex C (informative) Guideline for qualification and conformance inspection [Go to Page]
Table C.1 – Qualification and conformance inspection
Bibliography [Go to Page]

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BS EN IEC 61249-2-45:2018 Materials for printed boards and other interconnecting structures - Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.0W/m K) and defi, 2018

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