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  • BSI
    PD IEC/TR 60068-3-12:2014 Environmental testing - Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile
    Edition: 2014
    $313.97
    / user per year

Description of PD IEC/TR 60068-3-12:2014 2014

This part of IEC 60068 , which is a technical report, presents two approaches for establishing a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste.

This process covers a great variety of electronic products, including a large range of package sizes (e.g. molded active electronic components, passive components and electromechanical components).

Study A addresses requirements needed in the production of high-reliability electronic control units (ECU), as for example in automotive electronics. These requirements include measurement and production tolerances.

Study B represents consumer electronics products and includes reflow oven capability, board design and package sizes.



Standard NumberPD IEC/TR 60068-3-12:2014
TitleEnvironmental testing - Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile
StatusWithdrawn
Publication Date2014-10-17
Withdrawn Date2022-11-30
ReplacesPD IEC/TR 60068-3-12:2007
Identical National Standard OfIEC TR 60068-3-12:2014
DescriptorsElectrical components, Environmental testing, Solders, Printed-circuit boards, Solderability testing, Electrical equipment, Thermal testing, Electronic equipment and components, Thermal resistance, Heating tests, Testing conditions, Lead-free alloys
ICS19.040 Environmental testing
CommitteeEPL/501
ISBN978 0 580 85604 4
PublisherBSI
Pages20

About BSI

BSI Group, also known as the British Standards Institution is the national standards body of the United Kingdom. BSI produces technical standards on a wide range of products and services and also supplies certification and standards-related services to businesses.
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