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  • BSI
    BS IEC 62951-5:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Test method for thermal characteristics of flexible materials
    Edition: 2019
    $313.97
    / user per year

Description of BS IEC 62951-5:2019 2019

IEC 62951-5:2019 specifies the test method for thermal characteristics of flexible materials. This document includes terms, definitions, symbols, and test methods that can be used to evaluate and determine thermal characteristics of flexible materials for practical use. The measurement method relies on non-contact optical thermometry that is based on temperature dependent optical reflectance. This document is applicable to both substrate and thin-film flexible semiconductor materials that are subjected to bending and stretching.

Standard NumberBS IEC 62951-5:2019
TitleSemiconductor devices. Flexible and stretchable semiconductor devices - Test method for thermal characteristics of flexible materials
StatusDefinitive
Publication Date2019-03-05
Identical National Standard OfIEC 62951-5 Ed.1.0
DescriptorsReflectance, Thermal properties of materials, Flexible materials, Test methods, Semiconductor devices
ICS31.080.01 Semiconductor devices in general, 31.080.99 Other semiconductor devices
CommitteeEPL/47
ISBN978 0 580 97291 1
PublisherBSI
Pages20

About BSI

BSI Group, also known as the British Standards Institution is the national standards body of the United Kingdom. BSI produces technical standards on a wide range of products and services and also supplies certification and standards-related services to businesses.
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