FORMAT
BOOKS
PACKAGES
EDITION
PUBLISHER
CONTENT TYPE
Act
Admin Code
Announcements
Bill
Book
CADD File
CAN
CEU
Charter
Checklist
City Code
Code
Commentary
Comprehensive Plan
Conference Paper
County Code
Course
DHS Documents
Document
Errata
Executive Regulation
Federal Guideline
Firm Content
Guideline
Handbook
Interpretation
Journal
Land Use and Development
Law
Legislative Rule
Local Amendment
Local Code
Local Document
Local Regulation
Local Standards
Manual
Model Code
Model Standard
Notice
Ordinance
Other
Paperback
PASS
Periodicals
PIN
Plan
Policy
Product
Product - Data Sheet
Program
Provisions
Requirements
Revisions
Rules & Regulations
Standards
State Amendment
State Code
State Manual
State Plan
State Standards
Statute
Study Guide
Supplement
Sustainability
Technical Bulletin
All
|
Description of BS EN ISO 9455-17:2024 - TC 2024This document specifies a method of testing for deleterious effects that can arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, as specified in ISO 9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead (Sn/Pb) or Sn95,5Ag3Cu0,5 or other lead-free solders as agreed between user and supplier (see ISO 9453). This test method is also applicable to fluxes for use with lead-containing and lead-free solders. However, the soldering temperatures can be adjusted with agreement between tester and customer.
About BSIBSI Group, also known as the British Standards Institution is the national standards body of the United Kingdom. BSI produces technical standards on a wide range of products and services and also supplies certification and standards-related services to businesses. |
GROUPS
|