Cart (0)
  • No items in cart.
Total
$0
There is a technical issue about last added item. You can click "Report to us" button to let us know and we resolve the issue and return back to you or you can continue without last item via click to continue button.
Home
Content
Tour
eLibrary
Store
Search book title
Filters:
FORMAT
BOOKS
All Books
PACKAGES
All Packages
EDITION
to
PUBLISHER
AABC
(1)
AAMI
(337)
ACI
(589)
AISC
(55)
ASA
(234)
ASCE
(996)
ASHRAE
(690)
ASME
(2161)
ASSE
(117)
ASTM
(94624)
AWC
(54)
AWWA
(575)
BHMA
(124)
BICSI
(33)
BIFMA
(21)
BOMA
(20)
BSI
(94991)
CHD
(3)
CRSI
(17)
IAHSS
(1)
IAPMO
(374)
ICC
(315)
IEEE
(6731)
IES
(241)
ISEA
(16)
Joint Commission
(184)
Joint Commission Int.
(1)
NETA
(6)
NFPA
(1646)
TCNA
(17)
TMS
(19)
USGBC
(28)
WILEY
(4)
 
AR
(6)
AZ
(7)
CA
(115)
CT
(3)
FL
(57)
ID
(5)
IL
(5)
IN
(1)
KY
(1)
LA
(2)
MI
(25)
MN
(27)
NC
(27)
NJ
(13)
NY
(61)
OH
(24)
OR
(22)
PA
(7)
RI
(8)
SC
(20)
SD
(1)
TX
(3)
VA
(50)
VT
(6)
WA
(33)
CONTENT TYPE
 Act
 Admin Code
 Announcements
 Bill
 Book
 CADD File
 CAN
 CEU
 Charter
 Checklist
 City Code
 Code
 Commentary
 Comprehensive Plan
 Conference Paper
 County Code
 Course
 DHS Documents
 Document
 Errata
 Executive Regulation
 Federal Guideline
 Firm Content
 Guideline
 Handbook
 Interpretation
 Journal
 Land Use and Development
 Law
 Legislative Rule
 Local Amendment
 Local Code
 Local Document
 Local Regulation
 Local Standards
 Manual
 Model Code
 Model Standard
 Notice
 Ordinance
 Other
 Paperback
 PASS
 Periodicals
 PIN
 Plan
 Policy
 Product
 Product - Data Sheet
 Program
 Provisions
 Requirements
 Revisions
 Rules & Regulations
 Standards
 State Amendment
 State Code
 State Manual
 State Plan
 State Standards
 Statute
 Study Guide
 Supplement
 Sustainability
 Technical Bulletin
 All
  • BSI
    BS EN IEC 60749-10:2022 Semiconductor devices. Mechanical and climatic test methods - Mechanical shock. device and subassembly
    Edition: 2022
    $313.97
    / user per year

Description of BS EN IEC 60749-10:2022 2022

IEC 60749-10:2022 is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to determine the compatibility of devices and subassemblies to withstand moderately severe shocks. The use of subassemblies is a means to test devices in usage conditions as assembled to printed wiring boards. Mechanical shock due to suddenly applied forces, or abrupt change in motion produced by handling, transportation or field operation can disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test intended for device qualification. This edition cancels and replaces the first edition published in 2002. This edition includes the following significant technical changes with respect to the previous edition:
  1. covers both unattached components and components attached to printed wiring boards;
  2. tolerance limits modified for peak acceleration and pulse duration;
  3. mathematical formulae added for velocity change and equivalent drop height.


Standard NumberBS EN IEC 60749-10:2022
TitleSemiconductor devices. Mechanical and climatic test methods - Mechanical shock. device and subassembly
StatusDefinitive
Publication Date2022-08-16
ReplacesBS EN 60749-10:2002
Identical National Standard OfEN 60749-10 Ed.2.0, IEC 60749-10 Ed.2.0
DescriptorsIntegrated circuits, Destructive testing, Electronic equipment and components, Mechanical shock, Environmental testing, Climate, Mechanical testing, Impact testing, Semiconductor devices
ICS31.080.01 Semiconductor devices in general
CommitteeEPL/47
ISBN978 0 539 17345 1
PublisherBSI
Pages16

The following editions for this book are also available...

About BSI

BSI Group, also known as the British Standards Institution is the national standards body of the United Kingdom. BSI produces technical standards on a wide range of products and services and also supplies certification and standards-related services to businesses.
GROUPS
X