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  • BSI
    BS EN 60068-2-69:2007 Environmental testing - Tests. Test Te. Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
    Edition: 2007
    $423.36
    / user per year

Description of BS EN 60068-2-69:2007 2007

IEC 60068-2-69:2007 outlines test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices. These methods determine quantitatively the solderability of terminations on surface mounting devices. IEC 60068-2-54 is also available for surface mounting devices and should be consulted if applicable. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method and are both applicable to components with metallic terminations and metallized solder pads. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. This second edition cancels and replaces the first edition published in 1995 and constitutes a technical revision. The main changes from the previous edition are as follows:
- Inclusion of lead-free alloy test conditions;
- Inclusion of new fluxes for testing, reflecting development of fluxes that have happened in the industry in the past 20 years;
- Inclusion of new component types, and updating test parameters for the whole component list.

Standard NumberBS EN 60068-2-69:2007
TitleEnvironmental testing - Tests. Test Te. Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
StatusWithdrawn
Publication Date2007-07-31
Withdrawn Date2017-07-10
ReplacesBS EN 60068-2-69:1996
Replaced ByBS EN 60068-2-69:2017, BS EN 60068-2-69:2017+A1:2019
Identical National Standard OfIEC 60068-2-69:2007, EN 60068-2-69:2007
DescriptorsTest equipment, Electric terminals, Solderability testing, Environmental testing, Electrical equipment, Specimen preparation, Wettability, Solders, Testing conditions, Surface mounting devices, Electrical components, Electronic equipment and components
ICS31.190 Electronic component assemblies, 19.040 Environmental testing
CommitteeEPL/501
ISBN978 0 580 55860 3
PublisherBSI
Pages28
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