ASTM F677-04(2009)
Historical Standard: ASTM F677-04(2009) Standard Test Method for Fluid and Grease Resistance of Thermoset Encapsulating Compounds Used in Electronic and Microelectronic Applications
SUPERSEDED (see Active link, below)
ASTM F677
1. Scope
1.1 This test method determines the resistance of encapsulating compounds to fluids or greases by measuring changes in weight (Note 1) and volume under defined conditions of time and temperature.
Note 1To provide consistency with the usage in other ASTM test methods concerned with determining the properties of plastic materials, the terms weight and weigh are used in this test method although the units of measurement are those of mass.
1.2 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. See 9.1.
1.3 The values stated in SI units are standard. The values in parentheses are for information only.
Note 2There is no similar or equivalent IEC standard.
2. Referenced Documents (purchase separately) The documents listed below are referenced within the subject standard but are not provided as part of the standard.
ASTM Standards
D1193 Specification for Reagent Water
D1711 Terminology Relating to Electrical Insulation
D5423 Specification for Forced-Convection Laboratory Ovens for Evaluation of Electrical Insulation
D6054 Practice for Conditioning Electrical Insulating Materials for Testing
Keywords
electronic; encapsulating compound; grease; microelectronics ;
ICS Code
ICS Number Code 31.020 (Electronic components in general)
DOI: 10.1520/F0677-04R09
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