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Description of ASTM-D4300 2008ASTM D4300 - 01(2008)Standard Test Methods for Ability of Adhesive Films to Support or Resist the Growth of FungiActive Standard ASTM D4300 | Developed by Subcommittee: D14.30 Book of Standards Volume: 15.06 ASTM D4300Significance and Use These test methods are designed to be used to determine the susceptibility of the adhesive film to biodegradation and whether the adhesive will carry into the bond line sufficient anti-fungal properties to prevent growth of fungi frequently present on the gluing equipment, on adherends, or in the adhesive as applied. Potato dextrose agar (PDA) provides a complete medium for the growth of fungi, while mineral salts agar (MSA) lacks a carbohydrate source and provides a less favorable medium. Use of PDA tests the adhesive film for its ability to resist the growth of fungi on its surface as well as its ability to repel a copious growth of fungi on the adjacent agar surface. Use of MSA tests the adhesive film primarily for its ability to resist the growth of fungi on its surface. When it is used, there is a reduced possibility that the growth from the agar will be mis-read as coming from the adhesive film, since fungal growth on the adjacent agar will be scant. Note 2The method given here using the MSA is based on Practice G 21 , adapted to be used with adhesives. Requirements to meet the approval of government specifications are the use of the MSA described in 10.2, and a mixed species of fungi described in 8.2 for the inoculum. The results obtained when using the procedures given in this method apply only to the species used for the testing. The test species listed in Section 8 are frequently used by laboratories to test for antifungal properties, but they are not the only ones which could be used. Selection of the fungal species to test against requires informed judgment by the testing laboratory or by the party requesting the tests. These methods are especially useful when species that have been isolated from contaminated adhesives are used as the test species (see Section 8) to aid in the selection of more effective fungicides. The efficacy of some biocides may change in storage due to the chemical and thermal environment to which they are subjected as components of certain adhesives. These test methods are not appropriate for determining the effect of fungal contamination on adhesives under water-soaking conditions, because they are not designed to cover the possibility of water-soluble biocides leaching out of the bond line. These test methods are dependent upon the physiological action of living microorganisms under a reported set of conditions. Conclusions about the resistance of the test adhesive to fungal attack can be drawn by comparing the results to simultaneously run controls of known resistance. See X5.2 for statements regarding test repeatability. 1. Scope 1.1 These test methods test the ability of adhesive films to inhibit or support the growth of selected fungal species growing on agar plates by providing means of testing the films on two agar substrates, one which promotes microbial growth, and one which does not. 1.2 These test methods are not appropriate for all adhesives. The activity of certain biocides may not be demonstrated by these test methods as a result of irreversible reaction with some of the medium constituents. Note 1As an example, quaternary ammonium compounds are inactivated by agar. 1.3 A test method is included for use with low-viscosity adhesives along with an alternative method for use with mastic-type adhesives. Also, a method approved by the government is given. 1.4 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only. 1.5 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. These test methods are designed to be used by persons trained in correct microbiological techniques. Specific precautionary statements are given in Section 7 and in 14.3.2.
TAPPI Method T487 Fungus Resistance for Paper and Paperboard Available from Technical Association of the Pulp and Paper Industry (TAPPI), 15 Technology Parkway South, Norcross, GA 30092, http://www.tappi.org.ASTM Standards D907 Terminology of Adhesives D1286 Method of Test for Effect of Mold Contamination on Permanence of Adhesives Preparations and Adhesives Bonds G21 Practice for Determining Resistance of Synthetic Polymeric Materials to Fungi Keywords adhesive film; biodegradation; biological testing; fungi; Contamination--adhesives; Fungal influence/resistance--adhesives; Biodegradation; Biological data analysis; Dry adhesives; Microbiological examination; Mineral salts agar (MSA); Nuclear reactor vessels; Potato dextrose agar (PDA); Spore concentration (in inoculum); ICS Code ICS Number Code 83.180 (Adhesives) DOI: 10.1520/D4300-01R08 ASTM International is a member of CrossRef. ASTM D4300This book also exists in the following packages...Subscription InformationMADCAD.com ASTM Standards subscriptions are annual and access is unlimited concurrency based (number of people that can access the subscription at any given time) from single office location. For pricing on multiple office location ASTM Standards Subscriptions, please contact us at info@madcad.com or +1 800.798.9296.
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About ASTMASTM International, formerly known as the American Society for Testing and Materials (ASTM), is a globally recognized leader in the development and delivery of international voluntary consensus standards. Today, some 12,000 ASTM standards are used around the world to improve product quality, enhance safety, facilitate market access and trade, and build consumer confidence. ASTM’s leadership in international standards development is driven by the contributions of its members: more than 30,000 of the world’s top technical experts and business professionals representing 150 countries. Working in an open and transparent process and using ASTM’s advanced electronic infrastructure, ASTM members deliver the test methods, specifications, guides, and practices that support industries and governments worldwide. |
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