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  • ASTM
    D4300-01 Standard Test Methods for Ability of Adhesive Films to Support or Resist the Growth of Fungi
    Edition: 2001
    $103.58
    Unlimited Users per year

Description of ASTM-D4300 2001

ASTM D4300-01

Historical Standard: ASTM D4300-01 Standard Test Methods for Ability of Adhesive Films to Support or Resist the Growth of Fungi

SUPERSEDED (see Active link, below)




ASTM D4300

1. Scope

1.1 These test methods test the ability of adhesive films to inhibit or support the growth of selected fungal species growing on agar plates by providing means of testing the films on two agar substrates, one which promotes microbial growth, and one which does not.

1.2 These test methods are not appropriate for all adhesives. The activity of certain biocides may not be demonstrated by these test methods as a result of irreversible reaction with some of the medium constituents.

Note 1As an example, quaternary ammonium compounds are inactivated by agar.

1.3 A test method is included for use with low-viscosity adhesives along with an alternative method for use with mastic-type adhesives. Also, a method approved by the government is given.

1.4 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only.

1.5 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. These test methods are designed to be used by persons trained in correct microbiological techniques. Specific precautionary statements are given in Section 7 and in 14.3.2.


2. Referenced Documents (purchase separately) The documents listed below are referenced within the subject standard but are not provided as part of the standard.

TAPPI Method

T487 Fungus Resistance for Paper and Paperboard Available from Technical Association of the Pulp and Paper Industry (TAPPI), 15 Technology Parkway South, Norcross, GA 30092, http://www.tappi.org.

ASTM Standards

D907 Terminology of Adhesives

D1286 Method of Test for Effect of Mold Contamination on Permanence of Adhesives Preparations and Adhesives Bonds

G21 Practice for Determining Resistance of Synthetic Polymeric Materials to Fungi


Keywords

adhesive film; biodegradation; biological testing; fungi; Contamination--adhesives; Fungal influence/resistance--adhesives; Biodegradation; Biological data analysis; Dry adhesives; Microbiological examination; Mineral salts agar (MSA); Nuclear reactor vessels; Potato dextrose agar (PDA); Spore concentration (in inoculum);


ICS Code

ICS Number Code 83.180 (Adhesives)


DOI: 10.1520/D4300-01

ASTM International is a member of CrossRef.


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About ASTM

ASTM International, formerly known as the American Society for Testing and Materials (ASTM), is a globally recognized leader in the development and delivery of international voluntary consensus standards. Today, some 12,000 ASTM standards are used around the world to improve product quality, enhance safety, facilitate market access and trade, and build consumer confidence. ASTM’s leadership in international standards development is driven by the contributions of its members: more than 30,000 of the world’s top technical experts and business professionals representing 150 countries. Working in an open and transparent process and using ASTM’s advanced electronic infrastructure, ASTM members deliver the test methods, specifications, guides, and practices that support industries and governments worldwide.

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