ASTM D1867-96
Historical Standard: ASTM D1867-96 Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring
SUPERSEDED (see Active link, below)
ASTM D1867
1. Scope
1.1 This specification covers twelve grades of thermosetting laminate with copper foil bonded to one or both surfaces. These combination forms are intended primarily for use in fabrication of printed (etched) wiring or circuit boards.
1.2 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only.
1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
2. Referenced Documents (purchase separately) The documents listed below are referenced within the subject standard but are not provided as part of the standard.
ASTM Standards
D709 Specification for Laminated Thermosetting Materials
D1711 Terminology Relating to Electrical Insulation
D3636 Practice for Sampling and Judging Quality of Solid Electrical Insulating Materials
D5109 Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards
Other Standards
NEMAPublicationNumbeKeywords
circuit board; copper-clad laminate; printed circuit board; printed wiring board; thermosetting laminate;
ICS Code
ICS Number Code 31.180 (Printed circuits and boards)
DOI: 10.1520/D1867-96
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