Abstract

This specification covers twelve grades of thermosetting laminate with copper foil cladded to one or both surfaces. These combination forms are intended primarily for use in fabrication of printed (etched) wiring or circuit boards. The laminates shall meet the following requirements: peel strength after solder float and at elevated temperature conditions; lengthwise and crosswise flexural strengths; flammability rating; water absorption; volume resistivity; dielectric breakdown parallel to laminations; dissipation factor; and permittivity. Warp or twist, and blistering requirements shall also be tested for conformance.

This abstract is a brief summary of the referenced standard. It is informational only and not an official part of the standard; the full text of the standard itself must be referred to for its use and application. ASTM does not give any warranty express or implied or make any representation that the contents of this abstract are accurate, complete or up to date.

1. Scope

1.1 This specification covers twelve grades of thermosetting laminate with copper foil bonded to one or both surfaces. These combination forms are intended primarily for use in fabrication of printed (etched) wiring or circuit boards.

1.2 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only.

This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

2. Referenced Documents (purchase separately) The documents listed below are referenced within the subject standard but are not provided as part of the standard.

ASTM Standards

D709 Specification for Laminated Thermosetting Materials

D1711 Terminology Relating to Electrical Insulation

D3636 Practice for Sampling and Judging Quality of Solid Electrical Insulating Materials

D5109 Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards

Other Standards

Keywords

circuit board; copper-clad laminate; printed circuit board; printed wiring board; thermosetting laminate;

ICS Code

ICS Number Code 31.180 (Printed circuits and boards)

DOI: 10.1520/D1867-07

ASTM International is a member of CrossRef.

ASTM D1867