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eLibrary > PD IEC/TS 62686-1:2012 Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications - General requirements for high reliability integrated circuits and discrete semiconductors >

PD IEC/TS 62686-1:2012 Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications - General requirements for high reliability integrated circuits and discrete semiconductors, 2012

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PD IEC/TS 62686-1:2012 Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications - General requirements for high reliability integrated circuits and discrete semiconductors, 2012

30272133-VOR.pdf [Go to Page]
CONTENTS
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and abbreviations [Go to Page]
3.1 Terms and definitions
3.2 Abbreviations
4 Technical requirements [Go to Page]
4.1 General
4.2 Procedures [Go to Page]
4.2.1 General
4.2.2 Product discontinuance
4.2.3 ESD protection during manufacture
4.2.4 Specification control
4.2.5 Traceability
4.3 Product or process change notification (PCN) [Go to Page]
4.3.1 General
4.3.2 Notification
4.3.3 Notification details
4.3.4 Notifiable changes
4.4 Shipment controls [Go to Page]
4.4.1 General
4.4.2 Shipping container and date code marking
4.4.3 Date code remarking
4.4.4 Inner container formation
4.4.5 Date code age on delivery
4.4.6 ESD marking
4.4.7 MSL
4.4.8 Lead-free marking
4.4.9 Labels
4.5 Electrical [Go to Page]
4.5.1 General
4.5.2 Electrical test
4.5.3 Electrical parameter assessment
4.5.4 SDRAM memories
4.5.5 Logic families
4.5.6 Power MOSFETs
4.5.7 Silicon rectifier diodes
4.6 Mechanical [Go to Page]
4.6.1 General
4.6.2 Device or shipping container marking
4.6.3 Small packages
4.6.4 Moisture sensitivity
4.6.5 Robustness of hermetic seals
4.6.6 Termination finishes
4.7 Audit capability [Go to Page]
4.7.1 General
4.7.2 Internal quality audits
4.7.3 Subcontract manufacturing
4.8 Quality assurance [Go to Page]
4.8.1 General
4.8.2 Quality system
4.8.3 Sampling plans
4.8.4 Failure analysis support
4.8.5 Outgoing quality
4.9 Supplier performance monitoring by the user [Go to Page]
4.9.1 General
4.9.2 Lot acceptance
4.9.3 Suspension of deliveries
4.9.4 Loss of approval
4.9.5 AQL figures
4.9.6 100 % screening
4.9.7 Termination determination
4.10 Qualification [Go to Page]
4.10.1 General
4.10.2 Methodology
4.10.3 Test samples
4.10.4 Qualification categories
4.10.5 Maintenance of qualification standard
4.10.6 In-process test results
4.10.7 Product monitor results
4.10.8 References
4.10.9 Qualification report
4.10.10 Archiving
4.10.11 Qualification by similarity
4.10.12 Similarity assessment
4.11 Reliability [Go to Page]
4.11.1 General
4.11.2 Operating reliability
4.11.3 Failure criteria
4.11.4 Corrective action
4.11.5 Warranty
4.11.6 Suspension of certification
4.11.7 Single event effects (SEE)
4.12 Product monitor [Go to Page]
4.12.1 General
4.12.2 Monitor programme
4.12.3 Problem notification
4.12.4 Data reporting
4.12.5 Samples
4.12.6 Production maturity factors
4.12.7 Device dissipation
4.12.8 Corrective action
4.12.9 Product monitor results
4.12.10 Accumulated test data
4.13 Environmental, health and safety (EHS) [Go to Page]
4.13.1 General
4.13.2 EHS compliance
4.13.3 Device handling
4.13.4 Device materials
4.14 Shipping container [Go to Page]
4.14.1 General
4.14.2 ESD requirements
4.14.3 Magazine reuse
4.14.4 Tubes
4.14.5 Trays
4.15 Compliance with internal standards
Annex A (informative) Test code (TC) information
Annex B (informative) Cross-reference to STACK specification S/0001 revision 14
Bibliography
Tables [Go to Page]
Table 1 – Label requirements
Table 2 – Internal quality audit requirements
Table 3 – Outgoing quality
Table 4 – Incoming test
Table 5 – Technology/family qualification and device qualification
Table 6 – Operating life failure rates
Table 7 – Production maturity factors
Table 8 – Product monitor tests
Table A.1 – Conditions of the DC over voltage stress methodof JP001.01 or IEC 62416 test
Table A.2 – Examples of temperature acceleration factors
Table A.3 – Test conditions
Table A.4 – Relationship between write/erase cycle and data retention [Go to Page]

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PD IEC/TS 62686-1:2012 Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications - General requirements for high reliability integrated circuits and discrete semiconductors, 2012

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