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PD IEC/PAS 62647-1:2011 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder - Lead-free management, 2012
- 30249329-VOR.pdf [Go to Page]
- CONTENTS
- FOREWORD
- INTRODUCTION
- 1 Scope
- 2 Normative references
- 3 Terms and definitions
- 4 Symbols and abbreviated terms
- 5 Objectives [Go to Page]
- 5.1 General
- 5.2 Reliability
- 5.3 Configuration control and product identification
- 5.4 Risks and limitations of use
- 5.5 Deleterious effects of tin whiskers
- 5.6 Repair, rework, maintenance, and support
- 6 Technical requirements [Go to Page]
- 6.1 General
- 6.2 Reliability
- 6.3 Configuration control and product identification
- 6.4 Risks and limitations of use
- 6.5 Deleterious effects of tin whiskers
- 6.6 Repair, rework, maintenance, and support
- 7 Plan administrative requirements [Go to Page]
- 7.1 Plan organization
- 7.2 Terms and definitions
- 7.3 Plan focal authority
- 7.4 References
- 7.5 Plan applicability
- 7.6 Plan implementation
- 7.7 Plan acceptance
- 7.8 Plan modifications
- Bibliography
- Figure 1 – Relationship of IEC/PAS 62647-1, IEC/PAS 62647-2, GEIA-HB-0005-1, and GEIA-HB-0005-2 with each other, and with information about Pb-free electronics from sources external to the aerospace and high performance electronics industries
- Figure 2 – Schematic diagram of the content of a performance plan compliant to IEC/PAS 62647-1 [Go to Page]
