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eLibrary > PD IEC TS 62686-1:2020 Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications - General requirements for high reliability integrated circuits and discrete semiconductors >

PD IEC TS 62686-1:2020 Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications - General requirements for high reliability integrated circuits and discrete semiconductors, 2020

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PD IEC TS 62686-1:2020 Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications - General requirements for high reliability integrated circuits and discrete semiconductors, 2020

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CONTENTS
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and abbreviated terms [Go to Page]
3.1 Terms and definitions
3.2 Abbreviated terms
4 Technical requirements [Go to Page]
4.1 General [Go to Page]
4.1.1 Overview
4.1.2 Automotive components
4.2 Procedures [Go to Page]
4.2.1 General
4.2.2 Product discontinuance
4.2.3 ESD protection during manufacture
4.2.4 Specification control
4.2.5 Traceability including anti-counterfeit measures
4.3 Product or process change notification (PCN) [Go to Page]
4.3.1 General
4.3.2 Notification
4.3.3 Notification details
4.3.4 Notifiable changes
4.4 Shipment controls [Go to Page]
4.4.1 General
4.4.2 Shipping container and date code marking
4.4.3 Date code remarking
4.4.4 Inner container formation
4.4.5 Date code age on delivery
4.4.6 ESD marking
4.4.7 MSL
4.4.8 Lead-free marking
4.4.9 Labels
4.5 Electrical [Go to Page]
4.5.1 General
4.5.2 Electrical test
4.5.3 Electrical parameter assessment
Tables [Go to Page]
Table 1 – Label requirements [Go to Page]
4.5.4 SDRAM memories
4.5.5 Logic families
4.5.6 Power MOSFETs
4.5.7 Silicon rectifier diodes
4.6 Mechanical [Go to Page]
4.6.1 General
4.6.2 Device marking
4.6.3 Small packages
4.6.4 Moisture sensitivity
4.6.5 Robustness of hermetic seals
4.6.6 Termination finishes
4.7 Audit capability [Go to Page]
4.7.1 General
4.7.2 Internal quality audits
Table 2 – Internal quality audit requirements [Go to Page]
4.7.3 Subcontract manufacturing
4.8 Quality assurance [Go to Page]
4.8.1 General
4.8.2 Quality system
4.8.3 Sampling plans
4.8.4 Failure analysis support
4.8.5 Outgoing quality
4.9 Qualification [Go to Page]
4.9.1 General
Table 3 – Outgoing quality [Go to Page]
4.9.2 Methodology
4.9.3 Test samples
4.9.4 Qualification categories
4.9.5 Maintenance of qualification standards
4.9.6 In-process test results
Table 4 – Technology/family qualification and device qualification (1 of 3) [Go to Page]
4.9.7 Product monitor results
4.9.8 References
4.9.9 Qualification report
4.9.10 Archiving
4.9.11 Qualification by similarity
4.9.12 Similarity assessment
4.10 Reliability [Go to Page]
4.10.1 General
4.10.2 Operating reliability
4.10.3 Failure criteria
4.10.4 Corrective action
4.10.5 Warranty
4.10.6 Single event effects (SEEs)
4.11 Product monitor [Go to Page]
4.11.1 General
4.11.2 Monitor programme
4.11.3 Problem notification
4.11.4 Data reporting
4.11.5 Samples
4.11.6 Corrective action
4.11.7 Product monitor results
4.11.8 Accumulated test data
4.12 Environmental health and safety (EHS) [Go to Page]
4.12.1 General
4.12.2 EHS compliance
4.12.3 Device handling
4.12.4 Device materials
4.13 Shipping containers [Go to Page]
4.13.1 General
4.13.2 ESD requirements
Table 5 – Product monitor tests [Go to Page]
4.13.3 Magazine reuse
4.13.4 Tubes
4.13.5 Trays
4.13.6 Tape and reel
4.14 Compliance with internal standards
Annex A (informative) Test code (TC) information [Go to Page]
A.1 General
A.2 TC1 – Autoclave (ATC)
A.3 TC2 – Bond strength, internal (BS)
A.4 TC3 – Die shear strength (DS)
A.5 TC4 – Electromigration (EM)
A.6 TC5 – Electrostatic discharge (ESD)
A.7 TC6 – Electrical test (ET)
A.8 TC7 – Electrical distributions (EDs)
A.9 TC8 – Flammability (FL)
A.10 TC9 – Hot carrier injection (HCI)
A.11 TC10 – Hermeticity (HE)
A.12 TC11 – High temperature bake (HTB)
Table A.1 – Conditions of the DC over the voltage stress methodof JP001.01 or IEC 62416 test
A.13 TC12 – High temperature blocking bias (HTBB)
A.14 TC13 – High temperature gate bias (HTGB)
A.15 TC14 – High temperature reverse bias (HTRB)
A.16 TC15 – High temperature operating life (HTOL) [Go to Page]
A.16.1 General
A.16.2 Qualification conditions
A.16.3 Test results assessment
A.16.4 Temperature acceleration factor
Table A.2 – Examples of temperature acceleration factors [Go to Page]
A.16.5 Supply voltage acceleration factor
A.17 TC16 – Latch-up (LU)
A.18 TC17 – Lead integrity (LI)
A.19 TC18 – Lid torque (LT)
A.20 TC19 – Mechanical sequence (MS) [Go to Page]
A.20.1 General
A.20.2 Constant acceleration
A.20.3 Vibration (variable frequency)
A.20.4 Mechanical shock
A.21 TC20 – Marking permanency (MP)
A.22 TC21 – Non-volatile memory operating life (NVL)
A.23 TC22 – Time dependent dielectric breakdown (oxide integrity) (OI)
A.24 TC23 – Package dimensions (PD)
A.25 TC24 – Power cycling (PTC)
A.26 TC25 – Resistance to solder heat (RSH)
A.27 TC26 – Solder preconditioning (PC)
A.28 TC27 – Solderability (SD)
A.29 TC28 – Soft error rate (SER)
Table A.3 – Dip and look test references
A.30 TC29 – Steady state operating life (SSOL)
A.31 TC30 – Temperature cycling (TPC)
Table A.4 – Parameter values for consideration
Table A.5 – Test conditions
A.32 TC31 – Temperature humidity reverse bias (THRB)
A.33 TC32 – Temperature humidity bias (THB or HAST)
A.34 TC33 – Terminal strength (TS)
A.35 TC34 – Thermal resistance (thermal impedance) (TR)
Table A.6 – Test methods
A.36 TC35 – Visual inspection (VI) [Go to Page]
A.36.1 TC35a – External visual inspection
A.36.2 TC35b – Internal visual inspection
A.37 TC36 – Water vapour content, internal (WV)
A.38 TC37 – Xray inspection (XR)
A.39 TC38 – Moisture sensitivity level (MSL)
A.40 TC39 – Ball shear test (BST)
A.41 TC40 – Negative bias temperature instability (NBTI)
A.42 TC41 – Accelerated tin whisker test
Annex B (informative) Typical automotive component requirements
Annex C (informative) Requirement matrix for IEC TS 62686-1 verification [Go to Page]
Table C.1 – Requirement matrix
Bibliography [Go to Page]

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PD IEC TS 62686-1:2020 Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications - General requirements for high reliability integrated circuits and discrete semiconductors, 2020

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