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eLibrary > DD IEC/PAS 62647-23:2011 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder - Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies >

DD IEC/PAS 62647-23:2011 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder - Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies, 2011

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DD IEC/PAS 62647-23:2011 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder - Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies, 2011

30251232-VOR.pdf [Go to Page]
CONTENTS
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Symbols and abbreviated terms
5 Pb-Free Concerns [Go to Page]
5.1 Reliability
5.2 Configuration management
5.3 Risk management
5.4 Tin whiskers
5.5 Copper dissolution (erosion)
6 Materials [Go to Page]
6.1 Solder
6.2 Fluxes
6.3 Piece parts
6.4 Printed circuit boards
6.5 Conformal coatings
7 Soldering equipment [Go to Page]
7.1 Hand soldering equipment
7.2 Fountain soldering
7.3 Convective soldering equipment
8 General rework/repair considerations [Go to Page]
8.1 Rework/repair procedure order of precedence
8.2 Technician training
8.3 Pb-Free rework/repair considerations
9 Pre-rework/repair processes [Go to Page]
9.1 Alloy identification
9.2 Piece part and CCA preparation
Table 1 – Assembly and piece part marking methods
10 Rework/repair processes [Go to Page]
10.1 Conductive Hand Soldering
10.2 Convective soldering process
11 Post-Rework/Repair Processes [Go to Page]
11.1 Cleaning
11.2 Inspection
11.3 Reapplication of Conformal Coating
Annex A (informative) Termination Finishes
Annex B (informative) Tin whiskers
Bibliography
Figure 1 – Soldering iron tip construction
Figure 2 – Worn soldering iron tip
Figure 3 – Copper dissolution
Table A.1 – Piece-part terminal and BGA ball metallization solder process compatibility risk (see IEC/PAS 62647-22 (GEIA-HB-0005-2))
Table A.2 – BGA Piece parts
Table B.1 – Tin whisker information (see IEC/PAS 62647-22 (GEIA-HB-0005-2))
Table B.2 – Piece part termination tin whisker risk(see IEC/PAS 62647-22 (GEIA-HB-0005-2)) [Go to Page]

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DD IEC/PAS 62647-23:2011 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder - Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies, 2011

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