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eLibrary > BS IEC 61000-4-36:2014 Electromagnetic compatibility (EMC) - Testing and measurement techniques. IEMI immunity test methods for equipment and systems >

BS IEC 61000-4-36:2014 Electromagnetic compatibility (EMC) - Testing and measurement techniques. IEMI immunity test methods for equipment and systems, 2014

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BS IEC 61000-4-36:2014 Electromagnetic compatibility (EMC) - Testing and measurement techniques. IEMI immunity test methods for equipment and systems, 2014

30316084-VOR.pdf [Go to Page]
CONTENTS
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and abbreviations [Go to Page]
3.1 Terms and defintions
3.2 Abbreviations
4 General
5 IEMI environments and interaction [Go to Page]
5.1 General
5.2 IEMI environments [Go to Page]
5.2.1 Technical capability groups
5.2.2 IEMI deployment scenarios
5.2.3 Radiated IEMI environment summary
5.2.4 Published conducted IEMI environments
5.3 Interaction with fixed installations [Go to Page]
5.3.1 General
5.3.2 Protection level
6 Test methods [Go to Page]
6.1 Derivation of applicable test methods
6.2 Derivation of transfer functions
6.3 Radiated tests using IEMI simulator
6.4 Radiated tests using a reverberation chamber
6.5 Complex waveform injection (CWI)
6.6 Damped sinusoidal injection (DSI)
6.7 Electrostatic discharge (ESD)
6.8 Electrically fast transient (EFT)
6.9 Antenna port injection
7 Test parameters [Go to Page]
7.1 Derivation of immunity test parameters
7.2 Radiated test parameters [Go to Page]
7.2.1 Generic hyperband test parameters (skilled capability group)
7.2.2 Generic mesoband test parameters (skilled capability group)
7.2.3 Generic hypoband/narrowband test parameters (skilled capability group)
7.3 Generic conducted IEMI test parameters [Go to Page]
7.3.1 General
7.3.2 Characteristics and performance of the fast damped oscillatory wave generator
7.4 Tailored test level derivation
7.5 Relevance of EMC immunity data
8 Bibliography
Annex A (informative) Failure mechanisms and performance criteria [Go to Page]
A.1 General
A.2 Failure mechanisms [Go to Page]
A.2.1 General
A.2.2 Noise
A.2.3 Parameter offset and drifts
A.2.4 System upset or breakdown
A.2.5 Component destruction
A.3 Effect of pulse width
A.4 Performance criteria
A.5 References
Annex B (informative) Developments in IEMI source environments [Go to Page]
B.1 General
B.2 IEMI environment
B.3 IEMI sources
B.4 Published radiated IEMI environments [Go to Page]
B.4.1 IEC 61000-2-13
B.4.2 Mil-Std-464C
B.4.3 The International Telecommunication Union (ITU)
B.4.4 Practical determination of a tailored test level – An example
B.5 Summary
B.6 References
Annex C (informative) Interaction with buildings [Go to Page]
C.1 Building attenuation
C.2 Coupling to cables
C.3 Low voltage cable attenuation
C.4 References
Annex D (informative) Relation between plane wave immunity testing and immunity testing in a reverberation chamber [Go to Page]
D.1 General
D.2 Relation between measurements of shielding effectiveness in the two environments
D.3 Relation between immunity testing in the two environments
D.4 Additional aspects
D.5 References
Annex E (informative) Complex waveform injection – Test method [Go to Page]
E.1 General
E.2 Prediction [Go to Page]
E.2.1 General
E.2.2 Example
E.3 Construction
E.4 Injection
E.5 Summary
E.6 References
Annex F (informative) Significance of test methodology margins [Go to Page]
F.1 General
F.2 Examples [Go to Page]
F.2.1 General
F.2.2 Negative contributions
F.2.3 Positive contributions
F.2.4 Summary
F.3 References
Annex G (informative) Intentional EMI – The issue of jammers [Go to Page]
G.1 General
G.2 Effects
G.3 Published accounts of jamming
G.4 Risk assessment
G.5 Mitigation
G.6 References
Figures [Go to Page]
Figure 1 – Example of radiated and conducted IEMI interaction with a building
Figure 2 – Assessment options
Figure 3 – Examples of ports
Figure 4 – Typical hyperband waveform
Figure 5 – Typical mesoband waveform
Figure 6 – Typical hypoband/narrowband waveform
Figure 7 – Waveform of the damped oscillatory wave (open circuit voltage)
Figure A.1 – IEMI induced offset of sensor output – Corruption of information
Figure A.2 – Collision of an induced disturbance with data bits [1]
Figure A.3 – Examples of destruction on a chip [2]
Figure A.4 – Generic failure trend as a function of pulse width
Figure B.1 – A comparison of HPEM and IEMI spectra [6]
Figure B.2 – Representation of typical IEMI radiation and coupling onto systems [3]
Figure B.3 – Parameter space in power/frequency occupied by sophisticated IEMI (i.e. DEW) sources [1]
Figure B.4 – Peak power and energy from continuous and pulsed (durations shown) microwave sources, narrowband and wideband
Figure B.5 – Peak powers of various types of pulsed HPM sources [1]
Figure B.6 – Peak vs. average power for microwave sources with duty factors indicated
Figure B.7 – Phase coherence leading to a compact HPM source with N2 scaling of output power
Figure B.8 – Briefcase mesoband UWB source sold by Diehl-Rheinmetall [3]
Figure B.9 – A do-it-yourself electromagnetic weapon made from an oven magnetron [13]
Figure B.10 – Plot of entire narrowband system weight as a function of output microwave power for land-mobile and land-transportable systems
Figure C.1 – Typical unprotected low-rise building plane wave E-field attenuation collected from references
Figure C.2 – Cable coupling – Resonance region
Figure C.3 – Mains cable attenuation profile
Figure E.1 – LLSC reference field measurement set-up
Figure E.2 – LLSC induced current measurement set-up
Figure E.3 – Typical LLSC magnitude-only transfer function
Figure E.4 – Prediction of induced current using minimum phase constraints
Figure E.5 – IEC 61000-2-9 early-time (E1) HEMP environment
Figure E.6 – Overlay of transfer function and threat (frequency domain)
Figure E.7 – Predicted current
Figure E.8 – Example of de-convolution result
Figure E.9 – Damped sinusoidal waveforms – Ten-component fit
Figure E.10 – Approximated and predicted transient
Figure E.11 – Approximated and predicted transient (0 ns to 100 ns)
Figure E.12 – Approximation and prediction transient – Frequency domain comparison
Figure E.13 – Variation in error for increasing number of damped sinusoids
Figure E.14 – Complex injection set-up
Figure E.15 – Amplifier requirements for various current levels
Figure E.16 – Comparison of predicted (green) and injected (red) current
Figure F.1 – Variation in induced currents as a result of configuration
Figure F.2 – Comparison of HPD and VPD induced currents
Figure F.3 – System variability
Figure F.4 – Comparison of single- and multi-port injection
Figure F.5 – Example transfer functions and worst-case envelope
Figure F.6 – Comparison of individual and worst-case transfer function predictions
Figure F.7 – Comparison between predicted and measured induced currents
Tables [Go to Page]
Table 1 – Possible IEMI Deployment Scenarios
Table 2 – Summary of radiated IEMI source output (rEfar) by capability group
Table 3 – Example protection levels
Table 4 – Generic hyperband test parameters (skilled capability group)
Table 5 – Generic mesoband test parameters (skilled capability group)
Table 6 – Generic hypoband/narrowband test parameters (skilled capability group)
Table 7 – Conducted IEMI test levels
Table 8 – Open circuit specifications
Table 9 – Short Circuit Specifications
Table A.1 – Recommended performance criteria
Table B.1 – IEMI environments from IEC 61000-2-13
Table B.2 – Hypoband/narrowband HPM environment
Table B.3 – Hyperband/wideband HPM environment
Table C.1 – Shielding effectiveness measurements for various power system buildings and rooms
Table E.1 – Time waveform norms [Go to Page]

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BS IEC 61000-4-36:2014 Electromagnetic compatibility (EMC) - Testing and measurement techniques. IEMI immunity test methods for equipment and systems, 2014

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