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eLibrary > BS EN IEC 62668-1:2019 Process management for avionics. Counterfeit prevention - Avoiding the use of counterfeit, fraudulent and recycled electronic components >

BS EN IEC 62668-1:2019 Process management for avionics. Counterfeit prevention - Avoiding the use of counterfeit, fraudulent and recycled electronic components, 2019

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BS EN IEC 62668-1:2019 Process management for avionics. Counterfeit prevention - Avoiding the use of counterfeit, fraudulent and recycled electronic components, 2019

undefined [Go to Page]
Annex ZA(normative)Normative references to international publicationswith their corresponding European publications
English [Go to Page]
CONTENTS
FOREWORD
1 Scope
2 Normative references
3 Terms, definitions and abbreviated terms [Go to Page]
3.1 Terms and definitions
3.2 Abbreviated terms
4 Technical requirements [Go to Page]
4.1 General
4.2 Minimum avionics OEM requirements
Tables [Go to Page]
Table 1 – Anti-counterfeit awareness training guidelines
4.3 Intellectual property [Go to Page]
4.3.1 General
4.3.2 Definition of intellectual property
4.4 Counterfeit consideration [Go to Page]
4.4.1 General
4.4.2 Legal definition of counterfeit
4.4.3 Fraudulent components
4.4.4 How to establish traceability
Figures [Go to Page]
Figure 1 – Suspect components perimeter [Go to Page]
4.4.5 Reasons for the loss of component traceability
4.5 The counterfeit problem [Go to Page]
4.5.1 General
4.5.2 General worldwide activities combating counterfeit issues
4.5.4 Counterfeiting activities and avionics equipment
4.5.5 Electronic components direct action groups
4.6 Recycled components [Go to Page]
4.6.1 General
4.6.2 Why the avionics industry does not use recycled components
4.6.3 How recycled components become suspect and potentially fraudulent
4.7 Original component manufacturer (OCM) anti-counterfeit guidelines [Go to Page]
4.7.1 General
4.7.2 Chinese Reliable Electronic Component Supplier (RECS) audit scheme
4.7.3 Original component manufacturer (OCM) ISO 9001 and AS/EN/JISQ 9100 Third Party Certification
4.7.4 Original component manufacturer's (OCM) trademarks
4.7.5 Original component manufacturer's (OCM) IP control
4.7.6 Original component manufacturer's (OCM) physical part marking and packaging marking
4.7.7 The Semiconductor Industries Association Anti Counterfeit Task Force (ACTF)
4.7.8 USA Trusted Foundry Program
4.7.9 USA Trusted IC Supplier Accreditation Program
4.7.10 Physical unclonable function (PUF)
4.7.11 Original component manufacturer (OCM) best practice
4.8 Distributor minimum accreditations
4.9 Distributor AS/EN/JISQ 9120 Third Party Certification
4.10 Franchised distributor network [Go to Page]
4.10.1 General
4.10.2 SAE AS6496
4.10.3 Control stock through tracking schemes
4.10.4 Control of scrap
4.10.5 RECS
4.11 Non-franchised distributor anti-counterfeit guidelines [Go to Page]
4.11.1 General
4.11.2 CCAP-101 certified program for independent distributor
4.11.3 SAE AS6081
4.11.4 OEM managed non-franchised distributors
4.11.5 Brokers
4.12 Avionics OEM anti-counterfeit guidelines when procuring components [Go to Page]
4.12.1 Anti-counterfeiting general approach
4.12.2 Buy from approved sources
4.12.3 Traceable components
4.12.4 Certificate of conformance and packing slip
4.12.5 Plan and buy sufficient quantities
4.12.6 Use of non- franchised distributors
4.12.7 Brokers
4.12.8 Contact the original manufacturer
4.12.9 Obsolete components and franchised aftermarket sources
4.12.10 IEC 62239-1 approved alternatives
4.12.11 Product redesign
4.12.12 Non traceable components
4.12.13 OEM anti-counterfeit plans including SAE AS5553 and SAE AS6174
Table 2 – IEC 62668-1 requirements satisfied or not if OEM has an approvedSAE AS5553A plan
Table 3 – IEC 62668-1 requirements satisfied or not if OEM has an approvedSAE AS5553B plan
4.13 OEM anti-counterfeit guidelines for their products [Go to Page]
4.13.1 IP control
4.13.2 Tamper-proofing the OEM design
4.13.3 Tamper-proof labels
4.13.4 Use of ASICs and FPGAs with IP protection features
4.13.5 Control the final OEM product marking
4.13.6 Control OEM scrap
4.13.7 OEM trademarks and logos
4.13.8 Control delivery of OEM products and spares and their useful life
4.13.9 MRO activities
4.14 Counterfeit, fraud and component recycling reporting [Go to Page]
4.14.1 General
4.14.2 USA FAA suspected unapproved parts (SUP) program
4.14.3 EASA
4.14.4 UK counterfeit reporting
4.14.5 EU counterfeit reporting
4.14.6 UKEA anti-counterfeiting forum
4.15 Anti-counterfeit awareness training
4.16 Information to support the management of the supply chain
Annex A (informative)Useful contacts [Go to Page]
A.1 World Intellectual Property Organization (WIPO) [Go to Page]
A.1.1 General
A.1.2 What is WIPO?
A.1.3 WIPO Intellectual Property Services
A.1.4 WIPO global network on Intellectual Property (IP) Academies
A.2 Anti-Counterfeiting Trade Agreement (ACTA) [Go to Page]
A.2.1 ACTA
A.2.2 Global Anti-Counterfeiting Network (GACG)
A.3 World Semiconductor Council (WSC) and GAMS
A.4 SEMI
A.5 Electronics Authorized Directory
A.6 UK [Go to Page]
A.6.1 The UK intellectual property office
A.6.2 Alliance for IP
A.6.3 UK Chartered Trading Standards Institute
A.6.4 UK HM Revenue and Customs
A.6.5 Anti-Counterfeiting Forum
A.6.6 Electronic Component Supplier Network (ESCN)
A.6.7 UK Ministry of Defence
A.7 Europe [Go to Page]
A.7.1 Europa Summaries of EU Legislation
A.7.2 Europol, the European Law Enforcement Agency
A.7.3 European Patent Office
A.7.4 EUIPO
A.7.5 European Aviation Safety Agency (EASA)
A.7.6 IECQ audit schemes
A.7.7 BEAMA
A.8 USA [Go to Page]
A.8.1 United States Patent and Trademark Office
A.8.2 The International Trade Administration, US Department of Commerce
A.8.3 International Intellectual Property Alliance
A.8.4 The Federal Aviation Administration (FAA)
A.8.5 Trusted Access Program Office (TAPO)
A.8.6 Independent Distributors of Electronics Association (IDEA)
A.8.7 ECIA formerly National Electronic Distributors Association (NEDA)
A.8.8 Components Technology Institute Inc. (CTI)
A.8.9 Defense Logistics Agency (DLA)
A.8.10 DFARS
A.8.11 IAQG
A.8.12 USA Homeland Security
A.9 China [Go to Page]
A.9.1 CNIPA
A.9.2 Chinese Patent and Trademark Office
A.9.3 China Electronics Associations:
A.9.4 China Quality Certification Centre (CQC)
A.9.5 Civil Aviation Administration of China (CAAC)
A.9.6 China lawinfo.Co Ltd., for Law info China
A.10 Japan – Japanese Patent Office (JPO)
A.11 Physical unclonable function
A.12 PUF and tags initiative and solutions [Go to Page]
A.12.1 The Hardware Intrinsic Security (HIS) initiative
A.12.2 Examples of tag providers
A.13 Examples of tamper-proof design companies
A.14 Examples of FPGA die serialization
A.15 Examples of NVRAM manufacturers
A.16 SAE G-19
A.17 iNEMI
A.18 OECD
A.19 ICC
A.20 Applied DNA Sciences
A.21 "Safety Directors" Forum
A.22 "Stop fake bearings" video
A.23 Industrial company’s online anti-counterfeit awareness training
A.24 Subscription based anti-counterfeit awareness training
A.25 USA Government anti-counterfeit publications and awareness training
A.26 IECQ WG6
A.27 Anti-counterfeiting videos
Annex B (informative)Examples of aftermarket sources [Go to Page]
B.1 Examples of franchised aftermarket sources
B.2 Examples of sources of franchised die which can be packaged
B.3 Examples of third party custom packaging houses which provide aftermarket solutions
B.4 Examples of emulated aftermarket providers
Annex C (informative)Typical example of a RECS certificate
Annex D (informative)Flowchart of IEC 62668-1 requirements [Go to Page]
Figure D.1 – Flowchart of IEC 62668-1 requirements andtheir relationship to external standards
Annex E (Informative)Typical use of anti-counterfeit standards in supply chains [Go to Page]
Figure E.1 – Available anti-counterfeit standards for supply chains
Figure E.2 – Overview of typical relationships for anti-counterfeit standardsin an avionics supply chain
Figure E.3 – Overview of typical anti-counterfeit standardsin an avionics OEM supply chain
Figure E.4 – IECQ OD 3702 traceability audit
Figure E.5 – Typical IECQ OD 3702 coverage in any supply chain
Bibliography [Go to Page]

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