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eLibrary > BS EN IEC 61190-1-3:2018 Attachment materials for electronic assembly - Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications >

BS EN IEC 61190-1-3:2018 Attachment materials for electronic assembly - Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications, 2018

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BS EN IEC 61190-1-3:2018 Attachment materials for electronic assembly - Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications, 2018

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English [Go to Page]
CONTENTS
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Classification [Go to Page]
4.1 General
4.2 Alloy composition
4.3 Solder form
4.4 Flux type
Tables [Go to Page]
Table 1 – Solder materials
4.5 Flux percentage and metal content
Table 2 – Flux types and designating symbols
4.6 Other characteristics
5 Requirements [Go to Page]
5.1 Materials
5.2 Alloys [Go to Page]
5.2.1 General
5.2.2 Variation D alloys
Table 3 – Flux percentage
5.3 Solder forms [Go to Page]
5.3.1 General
5.3.2 Bar solder
5.3.3 Wire solder
5.3.4 Ribbon solder
5.3.5 Solder powder
5.3.6 Special solder
5.4 Flux type and form [Go to Page]
5.4.1 General
5.4.2 Flux percentage
Table 4 – Standard solder powders [Go to Page]
5.4.3 Solder cores
5.4.4 Solder coatings
5.5 Flux residue dryness
5.6 Spitting
5.7 Solder pool
5.8 Labelling for product identification
5.9 Workmanship
6 Quality assurance provisions [Go to Page]
6.1 Responsibility for inspection and compliance [Go to Page]
6.1.1 General
6.1.2 Quality assurance programme
6.1.3 Test equipment and inspection facilities
6.1.4 Inspection conditions
6.2 Classification of inspections
Figures [Go to Page]
Figure 1 – Report form for solder alloy tests
Figure 2 – Report form for solder powder tests
Figure 3 – Report form for non-fluxed solder tests
Figure 4 – Report form for fluxed wire/ribbon solder tests
6.3 Inspection of materials
6.4 Qualification inspections [Go to Page]
6.4.1 General
6.4.2 Sample size
6.4.3 Inspection routine
Table 5 – Solder inspections
6.5 Quality conformance [Go to Page]
6.5.1 General
6.5.2 Inspection routine
6.5.3 Sampling plan
6.5.4 Rejected lots
6.6 Preparation of solder alloy for test [Go to Page]
6.6.1 General
6.6.2 Wire solder up to approximately 6 mm diameter
6.6.3 Ribbon solder and wire solder larger than approximately 6 mm diameter
7 Preparation for delivery – Preservation, packing and packaging
Annex A (informative)Selection of various alloys and fluxes for use in electronic soldering –General information concerning IEC 61190-1-3 [Go to Page]
A.1 Overview
A.2 Intended use [Go to Page]
A.2.1 General
A.2.2 Alloys
A.3 Acquisition requirements
A.4 Standard solder product packages [Go to Page]
A.4.1 General
A.4.2 Wire and ribbon solders
A.4.3 Bar solders
A.4.4 Solder powder
A.5 Protocol for establishing short names for IEC 61190-1-3 alloys [Go to Page]
A.5.1 Lead containing solder alloys and specialty alloy
A.5.2 Lead-free solder alloys
A.6 Standard description of solid solder products
Annex B (normative)Lead-free solder alloys [Go to Page]
Table B.1 – The composition and temperature characteristicsof lead-free solder alloys
Table B.2 – The composition and temperature characteristicsof common tin-lead alloys
Table B.3 – The composition and temperature characteristics for specialty (non-tin/lead) alloys
Table B.4 – the cross-reference from solidus and liquidus temperaturesto alloy names by temperature
Table B.5 – The cross-reference from ISO 9453 alloy numbers and designationsto IEC 61190-1-3 alloy names
Annex C (informative)Marking method of solder designation for mounted board,used in electronic equipment [Go to Page]
C.1 General
C.2 Marking [Go to Page]
C.2.1 Recommendation for marking
C.2.2 Marking for solder designation
C.2.3 Marking unit and location
Figure C.1 – Example of the marking for assembled board
Bibliography [Go to Page]

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BS EN IEC 61190-1-3:2018 Attachment materials for electronic assembly - Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications, 2018

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