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eLibrary > BS EN IEC 61189-5-503:2017 Test methods for electrical materials, printed board and other interconnection structures and assemblies - General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards >

BS EN IEC 61189-5-503:2017 Test methods for electrical materials, printed board and other interconnection structures and assemblies - General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards, 2018

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BS EN IEC 61189-5-503:2017 Test methods for electrical materials, printed board and other interconnection structures and assemblies - General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards, 2018

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CONTENTS
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Testing condition [Go to Page]
4.1 Standard condition
4.2 Judgment state
5 Specimen [Go to Page]
5.1 Outline of CAF test vehicle design [Go to Page]
5.1.1 Evaluation design for the glass cloth direction
Figures [Go to Page]
Figure 1 – Schematic of in-line test comb, with possible failure site [Go to Page]
5.1.2 Design between plated through hole (PTH)
Figure 2 – Schematic of staggered test comb, with possible failure site
Figure 3 – Manhattan distance
5.2 CAF test board [Go to Page]
5.2.1 Example A
Figure 4 – Schematic section of via pair with bias
Figure 5 – Example of inner layer via pads and layer patterns
Figure 6 – Example of no inner layer via pads and layer patterns [Go to Page]
5.2.2 Example B
Figure 7 – Insulation evaluation pattern for through-holes and via holes
Tables [Go to Page]
Table 1 – Dimension of insulation evaluation pattern for through-holes
Figure 8 – Layouts of the two versions of the CAF test boards
Table 2 – Test structures A1 through A4 design rules
5.3 Number of specimens
6 Equipment/Apparatus or material [Go to Page]
6.1 Environmental test chamber
6.2 Measuring equipment
6.3 Power supply
Table 3 – Test structures B1 through B4 design rules
6.4 Current limiting resistors
6.5 Connecting wire
6.6 Other dedicated fixtures
7 Resistance measurement method [Go to Page]
7.1 Manual insulation resistance measurement method
7.2 Automatic insulation resistance measurement method
Figure 9 – Measurement with insulation resistance meter
8 Test method [Go to Page]
8.1 Test method selection
8.2 Steady-state temperature and humidity test [Go to Page]
8.2.1 Object
8.2.2 Test condition
8.3 Temperature and humidity (12 h + 12 h) cycle test [Go to Page]
8.3.1 Object
Table 4 – Test condition [Go to Page]
8.3.2 Test condition
8.3.3 Number of cycles of the test
8.4 Temperature and humidity cyclic test with and without low temperature exposure [Go to Page]
8.4.1 Object
8.4.2 Test condition
8.5 Steady-state high temperature and high humidity (unsaturated pressurized vapour) test [Go to Page]
8.5.1 Object
Table 5 – Number of cycles of the test
Table 6 – Test condition [Go to Page]
8.5.2 Test condition
9 Procedure [Go to Page]
9.1 Test specimen preparation [Go to Page]
9.1.1 General
9.1.2 Sample identification
9.1.3 Prescreen for opens and shorts
Table 7 – Test condition (IEC 60068-2-66) [Go to Page]
9.1.4 Cleaning
9.1.5 Connecting wire
9.1.6 Cleaning after attachment
9.1.7 Dry
9.2 Precondition
9.3 Test procedure [Go to Page]
9.3.1 Setting of the specimen
9.3.2 Test voltage and measuring voltage
9.3.3 Temperature and humidity condition at the start time of the test
9.3.4 Measurement
Figure 10 – Temperature and humidity in a test [Go to Page]
9.3.5 Procedure in test interruption
9.3.6 End of test
9.4 Visual inspection [Go to Page]
9.4.1 General
9.4.2 Shape of electrochemical migration
Annex A (informative)Forms of electrochemical migration [Go to Page]
A.1 Example of dendrite-shaped migration
A.2 CAF (Example of migration along the glass fibre)
Figure A.1 – Example which is generated on the board surface
Figure A.2 – Example of CAF
Bibliography [Go to Page]

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BS EN IEC 61189-5-503:2017 Test methods for electrical materials, printed board and other interconnection structures and assemblies - General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards, 2018

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please select your company type below: