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eLibrary > BS EN IEC 61189-2-808:2024 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Thermal resistance of an assembly by thermal transient method >

BS EN IEC 61189-2-808:2024 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Thermal resistance of an assembly by thermal transient method, 2024

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BS EN IEC 61189-2-808:2024 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Thermal resistance of an assembly by thermal transient method, 2024

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Annex ZA (normative)Normative references to international publicationswith their corresponding European publications [Go to Page]
English [Go to Page]
CONTENTS
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Objective
5 Test specimen
Figures [Go to Page]
Figure 1 – Structure of an assembly
Figure 2 – The fabricated test sample
6 Test equipment and procedures [Go to Page]
6.1 Test method and recommended test parameters
6.2 Test equipment
6.3 Test procedure
7 Test result [Go to Page]
Figure 3 – Test structure for measuring thermal resistance
8 Report [Go to Page]
Figure 4 – Test result for thermal resistance of an assembly
Tables [Go to Page]
Table 1 – Test result for thermal resistance of an assembly
Annex A (informative) Additional test methods for thermal resistance [Go to Page]
Table A.1 – ASTM C1113
Table A.2 – ASTM E1461
Table A.3 – ASTM D5470
Annex B (informative) Thermal resistance of die attach materials [Go to Page]
B.1 Test specimen
B.2 Die attach materials
Figure B.1 –Structure of test sample using die attach material
Figure B.2 –The fabricated test sample using die attach material
B.3 Test result
Table B.1 – Properties for die attach materials
Figure B.3 – Test graph for die attach materials
Table B.2 – Test result for die attach materials
Annex C (informative) Uncertainty and repeatability for thermal resistance test [Go to Page]
C.1 Test specimen
C.2 Test result
Figure C.1 – Test structure for measuring thermal resistance
Figure C.2 – Test result for thermal resistance of assembly
Table C.1 – Test result for thermal resistance of assembly
Annex D (informative) Thermostat equipment [Go to Page]
Figure D.1 – Connection of the thermostat unit to the T3Ster® main system unit
Figure D.2 –Calibration diagram recorded by the T3Ster® thermostat
Bibliography [Go to Page]

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BS EN IEC 61189-2-808:2024 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Thermal resistance of an assembly by thermal transient method, 2024

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