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BS EN IEC 60947-4-3:2024 - TC Tracked Changes. Low-voltage switchgear and controlgear - Contactors and motor-starters. Semiconductor controllers and semiconductor contactors for non-motor loads, 2024
- 30506729
- A-30375224 [Go to Page]
- undefined
- Annex ZA (normative)Normative references to international publicationswith their corresponding European publications
- Annex ZZ (informative)Relationship between this European standard and the essential requirements of Directive 2014/30/EU [2014 OJ L96] aimed to be covered [Go to Page]
- CONTENTS
- FOREWORD
- INTRODUCTION
- 1 Scope
- 2 Normative references
- 3 Terms, definitions, symbols and abbreviated terms [Go to Page]
- 3.1 General
- 3.2 Alphabetical index of terms
- 3.3 Terms and definitions concerning the types of semiconductor controllers and semiconductor contactors (see Figure 1)
- 3.4 Terms and definitions concerning characteristics of semiconductor controllers and semiconductor contactors
- Figures [Go to Page]
- Figure 1 – Semiconductor control devices
- 3.5 Terms and definitions concerning safety aspects
- 3.6 Symbols and abbreviated terms
- 4 Classification
- 5 Characteristics of semiconductor controllers and semiconductor contactors [Go to Page]
- 5.1 Summary of characteristics
- 5.2 Type of equipment [Go to Page]
- 5.2.1 Kind of equipment
- 5.2.2 Number of poles
- 5.2.3 Kind of current
- 5.2.4 Interrupting medium (air, vacuum, etc.)
- 5.2.5 Operating conditions of the equipment
- Figure 2 – Methods of connecting
- 5.3 Rated and limiting values for main circuits [Go to Page]
- 5.3.1 Rated voltages
- 5.3.2 Currents
- 5.3.3 Rated frequency
- 5.3.4 Duty cycle values and symbols
- 5.3.5 Normal load and overload characteristics
- 5.3.6 Rated conditional short-circuit current
- 5.3.7 Controller power losses
- 5.4 Utilization category [Go to Page]
- 5.4.1 General
- 5.4.2 Assignment of ratings based on the results of tests
- 5.5 Control circuits
- 5.6 Auxiliary circuits
- Tables [Go to Page]
- Table 1 – Utilization categories
- Table 2 – Relative levels of severity
- 5.7 Vacant
- 5.8 Coordination with short-circuit protective devices (SCPD)
- 6 Product information [Go to Page]
- 6.1 Nature of information
- 6.2 Marking
- 6.3 Instructions for installation, operation, maintenance, decommissioning and dismantling
- 6.4 Environmental information
- 7 Normal service, mounting and transport conditions [Go to Page]
- 7.1 Normal service conditions [Go to Page]
- 7.1.1 Ambient air temperature
- 7.1.2 Altitude
- 7.1.3 Atmospheric conditions
- 7.1.4 Shock and vibrations
- 7.2 Conditions during transport and storage
- 7.3 Mounting
- 7.4 Electrical system disturbances and influences
- 8 Constructional and performance requirements [Go to Page]
- 8.1 Constructional requirements [Go to Page]
- 8.1.1 General
- 8.1.2 Materials
- 8.1.3 Current-carrying parts and their connections
- 8.1.4 Clearances and creepage distances
- 8.1.5 Actuator
- 8.1.6 Indication of the contact position
- 8.1.7 Additional requirements for equipment suitable for isolation
- 8.1.8 Terminals
- 8.1.9 Additional requirements for equipment provided with a neutral pole
- 8.1.10 Provisions for protective earthing
- 8.1.11 Enclosures for equipment
- 8.1.12 Degrees of protection of enclosed equipment
- 8.1.13 Conduit pull-out, torque and bending with metallic conduits
- 8.1.14 Limited energy source
- Table 14 – Limits for limited energy sources without an over-current protective device
- Table 15 – Limits for limited energy sources with an over-current protective device [Go to Page]
- 8.1.15 Stored charge energy circuit
- 8.1.16 Fault and abnormal conditions
- Table 16 – Limits for limited energy source with current limiting impedance [Go to Page]
- 8.1.17 Short-circuit and overload protection of ports
- 8.2 Performance requirements [Go to Page]
- 8.2.1 Operating conditions
- 8.2.2 Temperature-rise
- 8.2.3 Dielectric properties
- Table 3 – Temperature-rise limits for insulated coils in air and in oil [Go to Page]
- 8.2.4 Normal load and overload performance requirements
- Table 4 – Minimum overload current withstand time (Tx) in relation to overload current ratio (X)
- Table 5 – Minimum requirements for thermal stability test conditions
- Table 6 – Minimum requirements for overload current withstand test conditions
- Table 7 – Making and breaking capacity test – Making and breaking conditionsaccording to utilization categories for the mechanical switching device
- Table 8 – Conventional operational performance – Making and breaking conditionsaccording to utilization categories for the mechanical switching device [Go to Page]
- 8.2.5 Coordination with short-circuit protective devices
- 8.3 EMC requirements [Go to Page]
- 8.3.1 General
- 8.3.2 Immunity
- Table 9 – Specific performance criteria when EM disturbances are present [Go to Page]
- 8.3.3 Emission
- 9 Tests [Go to Page]
- 9.1 Kinds of tests [Go to Page]
- 9.1.1 General
- 9.1.2 Type tests
- 9.1.3 Routine tests
- 9.1.4 Sampling tests
- 9.1.5 Special tests
- 9.2 Compliance with constructional requirements [Go to Page]
- 9.2.1 General
- 9.2.2 Electrical performance of screwless-type clamping units
- 9.2.3 Ageing test for screwless-type clamping units
- 9.2.4 Limited energy source test
- 9.2.5 Breakdown of components
- 9.2.6 Wire flexing test
- 9.3 Compliance with performance requirements [Go to Page]
- 9.3.1 Test sequences
- 9.3.2 General test conditions
- 9.3.3 Performance under no load, normal load and overload conditions
- Table 10 – Thermal stability test specifications
- Table 11 – Blocking and commutating capability test specifications [Go to Page]
- 9.3.4 Performance under short-circuit conditions
- 9.4 EMC tests [Go to Page]
- 9.4.1 General
- 9.4.2 EMC immunity tests
- 9.4.3 EMC emission tests
- Table 12 – Terminal disturbance voltage limitsfor conducted radio-frequency emission (AC mains power port)
- 9.5 Routine and sampling tests [Go to Page]
- 9.5.1 General
- 9.5.2 Operation and operating limits
- 9.5.3 Dielectric tests
- Table 13 – Radiated emissions test limits
- Annexes [Go to Page]
- Annex A (normative)Marking and identification of terminals [Go to Page]
- A.1 General
- A.2 Marking and identification of terminals of semiconductor controllers and semiconductor contactors [Go to Page]
- A.2.1 Marking and identification of terminals of main circuits
- A.2.2 Marking and identification of terminals of control circuits
- Table A.1 – Main circuit terminal markings
- Annex B (informative)Typical service conditions for semiconductor controllersand semiconductor contactors [Go to Page]
- B.1 Control of resistive heating elements
- B.2 Switching of electric discharge lamp controls
- B.3 Switching of incandescent lamps
- B.4 Switching of transformers
- B.5 Switching of capacitor banks
- Annex C Vacant
- Annex D Vacant
- Annex E Vacant
- Annex F (informative)Operating capability
- Figure F.1 – Thermal stability test profile
- Figure F.2 – Overload withstand test profile
- Figure F.3 – Blocking and commutating capability test profile
- Annex G Vacant
- Annex H Vacant
- Annex I (normative)Modified test circuit for short-circuit testingof semiconductor contactors and semiconductor controllers
- Figure I.1 – Modified circuit for short-circuit testing of semiconductor devices
- Figure I.2 – Timeline for the short-circuit test of 9.3.4.1.6
- Annex J (informative)Vacant
- Annex K (normative)Examples of overvoltage category reduction [Go to Page]
- K.1 General
- K.2 Insulation to the surroundings [Go to Page]
- K.2.1 Circuits connected directly to the supply mains
- Figure K.1 – Basic insulation evaluation for circuits connected directlyto the origin of the installation mains supply
- Table K.1 – Drawing keys [Go to Page]
- [Go to Page]
- K.2.2 Insulation between circuits
- Figure K.2 – Basic insulation evaluation for circuitsconnected directly to the mains supply
- Figure K.3 – Basic insulation evaluation for equipment notpermanently connected to the mains supply
- Figure K.4 – Basic insulation evaluation for insulation between circuits connected directly to the origin of the installation mains supply and that are declared galvanically separated
- Figure K.5 – Basic insulation evaluation for insulation between circuits connected directly to the mains supply and that are declared galvanically separated
- Figure K.6 – Basic insulation evaluation for insulation between circuits not permanently connected directly to the mains supply and that are declared galvanically separated
- Figure K.7 – Basic insulation evaluation for insulation between circuits connected directly to the origin of the installation mains supply and that are declared galvanically separated where internal SPDs are used
- Figure K.8 – Basic insulation evaluation for insulation between circuits connected directly to the mains supply and that are declared galvanically separated where internal SPDs are used
- Figure K.9 – Basic insulation evaluation for insulation between circuits connected directly to the mains supply and that are declared galvanically separated
- Annex L (normative)Additional requirements and testsfor equipment with protective separation [Go to Page]
- L.1 General
- L.2 Terms and definitions
- L.3 Requirements [Go to Page]
- L.3.1 Test method for implementing protective impedance
- L.3.2 Touch current measurement
- Figure L.1 – Protection by means of protective impedance
- Figure L.2 – Measuring instrument
- Bibliography [Go to Page]