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BS EN IEC 60115-1:2023 - TC Tracked Changes. Fixed resistors for use in electronic equipment - Generic specification, 2023
- A-30355703.pdf [Go to Page]
- undefined
- European foreword
- 11 Addition of Annex ZA
- 12 Addition of a new Annex ZX
- Table ZX.1 — Cross-references for references to clauses
- Table ZX.2 — Cross-references for references to figures
- Table ZX.3 — Cross reference for references to tables [Go to Page]
- English [Go to Page]
- CONTENTS
- FOREWORD
- INTRODUCTION
- Figures [Go to Page]
- Figure 1 – Hierarchical system of specifications
- 1 Scope
- 2 Normative references
- 3 Terms, definitions, product technologies and product classifications [Go to Page]
- 3.1 Terms and definitions
- Figure 2 – Voltage and dissipation on a resistor below and above its critical resistance
- 3.2 Product technologies
- 3.3 Resistor encapsulations
- 3.4 Product classification
- 4 General requirements [Go to Page]
- 4.1 Units and symbols
- 4.2 Preferred values
- 4.3 Coding
- 4.4 Marking of the resistors
- 4.5 Marking of the packaging
- 4.6 Ordering designation
- 4.7 Permissible substitutions
- 4.8 Packaging
- 4.9 Storage
- 4.10 Transportation
- 5 General provisions for measurements and test methods [Go to Page]
- 5.1 General
- 5.2 Standard atmospheric conditions
- Tables [Go to Page]
- Table 1 – Reference atmospheric conditions
- Table 2 – Referee atmospheric conditions
- Table 3 – Standard atmospheric conditions for testing
- 5.3 Tolerances on test severity parameters
- Table 4 – Controlled atmospheric conditions for recovery
- Table 5 – Default tolerances on temperature specifications
- Table 6 – Default tolerances on voltage specifications
- 5.4 Drying
- 5.5 Mounting of specimens
- Table 7 – Default tolerances on duration specifications
- Table 8 – Specimen drying procedures
- 5.6 Measurement of resistance
- Table 9 – Voltages for resistance measurement
- Figure 3 – Standard measurement points on a leaded resistor
- Figure 4 – Standard measurement points on an SMD resistor
- 6 Electrical measurements and tests [Go to Page]
- 6.1 Resistance
- Figure 5 – Measurement points on an assembled SMD resistor
- Figure 6 – Permissible resistance range due to tolerance
- 6.2 Temperature coefficient of resistance
- Figure 7 – Permissible resistance range due to tolerance and TCR
- Figure 8 – Variation of resistance with temperature (example)
- Table 10 – Sequence of temperatures and measurements
- 6.3 Inductance
- Figure 9 – Test circuit for measurement of the inductance
- 6.4 Voltage coefficient of resistance
- Figure 10 – Exponential voltage rise caused by inductance
- 6.5 Nonlinearity
- 6.6 Current noise
- 6.7 Temperature rise
- 7 Endurance tests [Go to Page]
- 7.1 Endurance at the rated temperature 70 °C
- Figure 11 – Standard derating curve for the rated dissipation P70
- 7.2 Endurance at room temperature
- Figure 12 – Derating curve with specification of a suitable test dissipation
- Figure 13 – Derating curve without specification of a suitable test dissipation
- 7.3 Endurance at a maximum temperature
- Figure 14 – Derating curve for UCT ≥ MET
- Figure 15 – Derating curve for UCT < MET
- 8 Electrical overload tests [Go to Page]
- 8.1 Short-term overload
- 8.2 Single-pulse high-voltage overload test
- Figure 16 – Parameters of an open-circuit lightning impulse voltage
- Figure 17 – Circuit for generation of 1,2/50 pulses
- Figure 18 – Circuit for generation of 10/700 pulses
- Table 11 – Severities for the single-pulse high-voltage overload test
- 8.3 Periodic-pulse high-voltage overload test
- 8.4 Periodic-pulse overload test
- Table 12 – Severities for the periodic-pulse high-voltage overload test
- 8.5 Electrostatic discharge
- 9 Mechanical measurements and tests [Go to Page]
- 9.1 Visual examination
- 9.2 Gauging of dimensions
- 9.3 Detail dimensions
- 9.4 Robustness of the resistor body
- 9.5 Robustness of terminations
- Figure 19 – Testing of resistor body robustness
- Table 13 – Tensile test force for wire terminations
- 9.6 Robustness of threaded stud or screw terminations
- Table 14 – Test torque for threaded studs, screws and integral mounting devices
- 9.7 Shear test
- Figure 20 – Shear test for SMD resistors
- 9.8 Substrate bending test
- Table 15 – Recommended parameters for the substrate bending test
- Figure 21 – Substrate bending test for SMD resistors
- 9.9 Bump
- 9.10 Shock
- Table 16 – Recommended parameters for the bump test
- 9.11 Vibration
- Table 17 – Recommended parameters for the shock test
- Table 18 – Recommended parameters for the vibration test
- 10 Environmental and climatic tests [Go to Page]
- 10.1 Rapid change of temperature
- 10.2 Operation at low temperature
- Table 19 – Recommended parameters for the rapid change of temperature test
- 10.3 Climatic sequence
- Table 20 – Number of additional damp heat cycles
- 10.4 Damp heat, steady state
- Table 21 – Severity parameters for the damp heat, steady state test
- Table 22 – Bias voltage for the damp heat, steady state test
- 10.5 Damp heat, steady state, accelerated
- Table 23 – Severity parameters for the accelerated damp heat, steady state test
- 10.6 Corrosion
- Table 24 – Grouped DC bias voltages for < 25 % deviation
- Table 25 – Recommended parameters for the corrosion test
- 10.7 Whisker growth test
- 10.8 Hydrogen sulphide test
- Table 26 – Test methods and parameters for the whisker growth test
- 11 Tests related to component assembly [Go to Page]
- 11.1 Solderability
- Table 27 – Selection of accelerated ageing methods of IEC 60068-2-20
- Table 28 – Process temperatures for selected solder alloy examples
- Table 29 – Solderability test parameters for SMD resistors
- Table 30 – Solderability test parameters for resistors with wire or tag terminations
- 11.2 Resistance to soldering heat
- Table 31 – Resistance to soldering heat test parameters for SMD resistors
- Table 32 – RSH test parameters for resistors with wire or tag terminations
- 11.3 Solvent resistance
- 12 Tests related to safety [Go to Page]
- 12.1 Insulation resistance
- Table 33 – Recommended parameters for the solvent resistance test
- Figure 22 – V-block fixture
- Figure 23 – Foil method applied to a resistor specimen
- Figure 24 – Mounting method applied to a resistor specimen
- Figure 25 – Parallel clamp fixture for rectangular SMD resistors
- Figure 26 – V-clamp test fixture for cylindrical SMD resistors
- 12.2 Voltage proof
- Table 34 – Insulation resistance measuring voltage
- 12.3 Accidental overload test
- Figure 27 – Gauze fixture for axial cylindrical specimens
- Figure 28 – Gauze fixture dimensions for cylindrical specimens
- Figure 29 – Gauze fixture dimensions for non-cylindrical specimens
- 12.4 Flammability
- Table 35 – Recommended parameters for the accidental overload test
- 13 Quality assessment procedures
- Annexes [Go to Page]
- Annex A (normative) Symbols and abbreviated terms
- Annex B (normative) Rules for the preparation of detail specifications for resistors and capacitors for electronic equipment for use within the IECQ system
- Annex C (informative) Example of a certified test record
- Annex Q (informative) Quality assessment procedures [Go to Page]
- Q.1 General
- Q.2 IECQ Approved Component (IECQ AC) procedures
- Q.3 IECQ Qualification Approval (QA) procedures
- Q.4 IECQ Approved Component – Capability Certification (IECQ AC-C) procedures
- Q.5 IECQ Approved Component – Technology Certification (IECQ AC-TC) procedure
- Annex R (informative) Failure rate level evaluation, determination and qualification [Go to Page]
- R.1 General
- R.2 Certification and determination of a failure rate level
- Table R.1 – Requirements for the qualification of a failure rate level [Go to Page]
- R.3 Non-conformances
- R.4 Extension of a qualification to a higher failure rate level
- R.5 Maintenance of a failure rate level
- R.6 Deliveries
- Table R.2 – Requirements for the maintenance of a failure rate level qualification [Go to Page]
- R.7 Determination of a component failure rate
- Table R.3 – Environmental factor πE for determination of the component failure rate
- Table R.4 – Quality factor πQ for determination of the component failure rate
- Annex X (informative)Cross-references for references to the prior revision of this document
- Table X.1 – Cross-references for references to clauses (1 of 3)
- Bibliography [Go to Page]