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BS EN 60539-1:2016 Directly heated negative temperature coefficient thermistors - Generic specification, 2018
- undefined
- European foreword
- Endorsement notice
- Annex ZA (normative) Normative references to international publications with their corresponding European publications
- English [Go to Page]
- CONTENTS
- FOREWORD
- 1 Scope
- 2 Normative references
- 3 Terms and definitions
- Figures [Go to Page]
- Figure 1 – Typical resistance-temperature characteristic for NTC thermistors
- Figure 2 – Decreased power dissipation curve
- Figure 3 – Maximum current derating
- 4 General items [Go to Page]
- 4.1 Units and symbols
- 4.2 Preferred values and appropriate category [Go to Page]
- 4.2.1 General
- 4.2.2 Appropriate category
- 4.3 Marking [Go to Page]
- 4.3.1 General
- Tables [Go to Page]
- Table 1 – Lower and upper category temperatures and duration of the damp heat, steady state test [Go to Page]
- 4.3.2 Marking for small size types such as surface mount thermistors
- 4.3.3 Coding
- 4.4 Quality assessment procedures
- 5 Test and measurement procedures [Go to Page]
- 5.1 General
- 5.2 Standard atmospheric conditions for testing
- 5.3 Drying and recovery [Go to Page]
- 5.3.1 Drying
- 5.3.2 Recovery
- 5.4 Mounting (for surface mount thermistors only) [Go to Page]
- 5.4.1 General
- 5.4.2 Substrate and pad
- 5.4.3 Mounting on board
- 5.5 Visual examination and check of dimensions [Go to Page]
- 5.5.1 Visual examination
- 5.5.2 Dimensions
- 5.6 Zero-power resistance [Go to Page]
- 5.6.1 General
- 5.6.2 Measurement procedures
- 5.6.3 Requirements
- Figure 4 – Basic circuit for zero-power resistance measurement
- 5.7 B-value or resistance ratio [Go to Page]
- 5.7.1 General
- 5.7.2 Requirements
- 5.8 Insulation resistance (for insulated types only) [Go to Page]
- 5.8.1 General
- 5.8.2 Test methods
- Figure 5 – Example of Method 1 for testing the insulation resistance
- Figure 6 – Example of Method 2 for testing the insulation resistance (1)
- Figure 7 – Example of Method 2 for testing the insulation resistance (2) [Go to Page]
- 5.8.3 Applied voltage
- Figure 8 – Example of Method 3 for testing the insulation resistance
- Figure 9 – Example of Method 4 for testing the insulation resistance [Go to Page]
- 5.8.4 Requirements
- 5.9 Voltage proof (for insulated types only) [Go to Page]
- 5.9.1 General
- 5.9.2 Test voltage
- 5.9.3 Requirements
- 5.10 Resistance/temperature characteristic [Go to Page]
- 5.10.1 General
- 5.10.2 Test methods
- 5.10.3 Requirements
- 5.11 Dissipation factor (δ) [Go to Page]
- 5.11.1 General
- 5.11.2 Initial measurements
- 5.11.3 Test methods
- Figure 10 – Example of test chamber [Go to Page]
- 5.11.4 Requirements
- 5.12 Thermal time constant by ambient temperature change (τa) [Go to Page]
- 5.12.1 The hot to cold thermal time constant for ambient temperature change
- Figure 11 – Dissipation factor measuring circuit [Go to Page]
- 5.12.2 The cold to hot thermal time constant for ambient temperature change
- 5.12.3 Final measurements and requirements
- 5.12.4 Requirements
- 5.13 Thermal time constant by cooling after self-heating (τc) [Go to Page]
- 5.13.1 General
- 5.13.2 Initial measurements
- 5.13.3 Preconditioning
- 5.13.4 Test method
- 5.13.5 Final measurements and requirements
- Figure 12 – Thermal time constant measuring circuit
- 5.14 Robustness of terminations (not applicable to surface mount thermistors) [Go to Page]
- 5.14.1 General
- 5.14.2 Initial measurements
- 5.14.3 Test methods
- 5.14.4 Test Ua1 – Tensile
- 5.14.5 Test Ub – Bending (half the number of terminations)
- 5.14.6 Test Uc – Torsion (remaining terminations)
- Table 2 – Tensile force [Go to Page]
- 5.14.7 Final measurements and requirements
- 5.15 Resistance to soldering heat [Go to Page]
- 5.15.1 General
- 5.15.2 Preconditioning
- 5.15.3 Test procedure
- 5.15.4 Recovery
- 5.15.5 Final inspection, measurement and requirements
- 5.16 Solderability [Go to Page]
- 5.16.1 General
- 5.16.2 Test procedure
- 5.16.3 Final inspection, measurements and requirements
- 5.17 Rapid change of temperature [Go to Page]
- 5.17.1 General
- 5.17.2 Initial measurements
- 5.17.3 Test procedures
- 5.17.4 Final inspection, measurements and requirements
- 5.18 Vibration [Go to Page]
- 5.18.1 General
- 5.18.2 Initial measurements
- 5.18.3 Test procedures
- 5.18.4 Final inspection, measurements and requirements
- 5.19 Shock [Go to Page]
- 5.19.1 General
- 5.19.2 Initial measurements
- 5.19.3 Mounting
- 5.19.4 Test procedures
- 5.19.5 Final inspection, measurements and requirements
- 5.20 Free fall [Go to Page]
- 5.20.1 General
- 5.20.2 Initial measurements
- 5.20.3 Test procedures
- 5.20.4 Final inspection, measurements and requirements
- 5.21 Thermal shock [Go to Page]
- 5.21.1 General
- 5.21.2 Initial measurements
- 5.21.3 Test procedures
- 5.21.4 Final inspection, measurements and requirements
- 5.22 Cold [Go to Page]
- 5.22.1 General
- 5.22.2 Initial measurements
- 5.22.3 Test procedures
- 5.22.4 Final inspection, measurements and requirements
- 5.23 Dry heat [Go to Page]
- 5.23.1 General
- 5.23.2 Initial measurements
- 5.23.3 Test procedures
- 5.23.4 Final inspection, measurements and requirements
- 5.24 Damp heat, steady state [Go to Page]
- 5.24.1 General
- 5.24.2 Initial measurements
- 5.24.3 Test procedures
- 5.24.4 Recovery
- 5.24.5 Final inspection, measurements and requirements
- 5.25 Endurance [Go to Page]
- 5.25.1 General
- 5.25.2 Endurance at room temperature with applied continuous maximum current (Imax25) (for inrush current-limiting thermistors only)
- 5.25.3 Endurance at room temperature with applied cyclic maximum current (Imax25) (for inrush current-limiting thermistors only)
- Figure 13 – Endurance at room temperature with Imax25 evaluating circuit [Go to Page]
- 5.25.4 Endurance at T3 and Pmax
- 5.25.5 Endurance at upper category temperature
- 5.25.6 Maximum permissible capacitance (for inrush current-limiting thermistors only)
- Figure 14 – Maximum permissible capacitance test circuit (Method 1)
- 5.26 Shear (adhesion) test (for surface mount thermistors only) [Go to Page]
- 5.26.1 General
- Figure 15 – Maximum permissible capacitance test circuit (Method 2) [Go to Page]
- 5.26.2 Test conditions
- 5.26.3 Requirements
- 5.27 Substrate bending test (for surface mount thermistors only) [Go to Page]
- 5.27.1 General
- 5.27.2 Initial measurements
- 5.27.3 Test procedures
- 5.27.4 Final inspection and requirements
- 5.28 Component solvent resistance [Go to Page]
- 5.28.1 General
- 5.28.2 Initial measurements
- 5.28.3 Test conditions
- 5.28.4 Requirements
- 5.29 Solvent resistance of marking [Go to Page]
- 5.29.1 General
- 5.29.2 Test conditions
- 5.29.3 Requirements
- 5.30 Salt mist [Go to Page]
- 5.30.1 General
- 5.30.2 Test conditions
- 5.31 Sealing
- 5.32 Composite temperature/humidity cycle [Go to Page]
- 5.32.1 General
- 5.32.2 Initial measurements
- 5.32.3 Test conditions
- 5.32.4 Final inspection, measurements and requirements
- Annex A (normative) Interpretation of sampling plans and procedures as described in IEC 60410:1973 for use within quality assessment systems [Go to Page]
- A.1 Clause and subclause numbers of IEC 60410:1973
- Annex B (normative) Rules for the preparation of detail specifications for directly heated thermistors for electronic equipment for use within quality assessment systems [Go to Page]
- B.1 Drafting
- B.2 Reference standard
- B.3 Circulation
- Annex C (informative) Typical examples of mountings for measurements ofdirectly heated thermistors [Go to Page]
- C.1 Mounting for surface mount thermistors
- Figure C.1 – Mounting for measurements of surface mount thermistors
- Annex D (informative) Reference to IEC 60539-1:2008
- Annex Q (normative) Quality assessment procedures [Go to Page]
- Q.1 General
- Q.2 Primary stage of manufacture
- Q.3 Structurally similar components
- Q.4 Qualification approval procedures [Go to Page]
- Q.4.1 General
- Q.4.2 Test procedure for qualification approval
- Q.4.3 Maintenance of qualification approval
- Q.5 Quality conformance inspection
- Q.6 Certified test records of released lots
- Q.7 Delayed delivery
- Q.8 Release for delivery under qualification approval before the completion of group B tests
- Q.9 Alternative test methods
- Q.10 Unchecked parameters
- Bibliography [Go to Page]
