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eLibrary > BS EN 60068-2-69:2017 Environmental testing - Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method >

BS EN 60068-2-69:2017 Environmental testing - Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method, 2018

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BS EN 60068-2-69:2017 Environmental testing - Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method, 2018

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English [Go to Page]
CONTENTS
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General description of the method [Go to Page]
4.1 General
4.2 Components
4.3 Printed boards
4.4 Measurement
5 Description of the test apparatus
Figures [Go to Page]
Figure 1 – Arrangement for the test apparatus (solder bath wetting balance method)
Figure 2 – Arrangement for the test apparatus (solder globule wetting balance method)
6 Preparation of specimens [Go to Page]
6.1 Cleaning
6.2 Preconditioning
Tables [Go to Page]
Table 1 – Preconditioning
7 Materials [Go to Page]
7.1 Solder [Go to Page]
7.1.1 General
7.1.2 Solder alloy containing lead
7.1.3 Lead-free solder alloy
7.1.4 Solder contamination control
7.1.5 Solder mass for solder globule wetting balance method
Table 2 – Maximum limits of solder bath contaminants
Table 3 – Globule and pellet sizes
7.2 Flux [Go to Page]
7.2.1 Rosin based flux
7.2.2 Flux maintenance
7.2.3 Test flux selection criteria
8 Procedure [Go to Page]
8.1 Test temperature [Go to Page]
8.1.1 Solder alloy containing lead
8.1.2 Lead-free solder alloy
8.2 Test procedure [Go to Page]
8.2.1 Applicable test procedure
Table 4 – Rosin based flux compositions [Go to Page]
8.2.2 Solder bath wetting balance procedure
Table 5 – Recommended solder bath wetting balance test conditions
Figure 3 – Immersion conditions for solder bath method [Go to Page]
8.2.3 Solder globule wetting balance procedure
Table 6 – Time sequence of the test (solder bath)
Table 7 – Recommended solder globule wetting balance test conditions
Figure 4 – Immersion conditions for solder globule method [Go to Page]
8.2.4 Procedure for testing printed board specimens
Figure 5 – Suggested wetting balance test specimens and soldering immersion
Table 8 – Time sequence of the test (solder globule)
9 Presentation of results [Go to Page]
9.1 Form of force versus time trace
Figure 6 – Printed board immersion
9.2 Test requirements
Figure 7 – Typical wetting balance trace
10 Information to be given in the relevant specification
Annex A (normative)Equipment specification [Go to Page]
A.1 Characteristics of the apparatus
A.2 Solder bath
A.3 Globule support blocks
Annex B (informative)Use of the wetting balance for SMD solderability testing [Go to Page]
B.1 Definition of the measure of solderability
B.2 Gauge R&R – Test protocol for wetting balance gauge repeatability and reproducibility using copper foil coupons [Go to Page]
B.2.1 Test coupon
B.2.2 Test parameters
B.2.3 Known good coupon
B.3 Solder globule mass and pin size
B.4 Specimen orientation and immersion depth [Go to Page]
B.4.1 General
B.4.2 Resistors and capacitors
B.4.3 Small-leaded components
B.4.4 Multi-leaded devices
B.5 Test flux
B.6 Test temperature [Go to Page]
B.6.1 Solder alloy containing lead
Table B.1 – Carboxylic acid based flux (water solution)
Table B.2 – Carboxylic acid based flux (alcohol solution) [Go to Page]
B.6.2 Solder alloy without lead
B.7 Characteristics of the test apparatus [Go to Page]
B.7.1 Recording device
B.7.2 Balance system
B.7.3 Lifting mechanism and controls
Figure B.1 – Understanding wetting curves
Figure B.2 – Typical wetting curve
Figure B.3 – Representative force-time curves [Go to Page]
B.7.4 Parameters to be measured from the force-time trace
B.7.5 Reference wetting force
B.7.6 Equipment location
B.7.7 Globule pins
B.7.8 Globule modules
B.8 Test flux – IPC-J-STD-002/J-STD-003 activated solderability test flux rationale committee letter [Go to Page]
B.8.1 General
B.8.2 Proactive solderability testing approach to the implementation of non-tin finishes
B.8.3 Reduced solderability test variability
B.8.4 Standardization of solderability test flux composition on a global scale
Annex C (normative)Test methods for SMD components sizes 0603M (0201) or smaller [Go to Page]
C.1 General
C.2 General description of the test method
C.3 Preconditioning [Go to Page]
C.3.1 Preparation of the specimens
C.3.2 Ageing
C.4 Materials [Go to Page]
C.4.1 Solder
C.4.2 Flux
C.5 Method 1 [Go to Page]
C.5.1 Description of the test apparatus
C.5.2 Procedures
Figure C.1 – Cross-section of aluminium body
Figure C.2 – Dipping position and relative position
Table C.1 – Time sequence of the test procedure [Go to Page]
C.5.3 Presentation of results
Figure C.3 – Time and test sequence [Go to Page]
C.5.4 Information to be given in the relevant specification
Figure C.4 – Typical wetting balance trace
C.6 Method 2 [Go to Page]
C.6.1 Test apparatus
C.6.2 Observation equipment
C.6.3 Test method 2
C.6.4 Presentation of results
Annex D (informative)Evaluation criteria – Guidance [Go to Page]
D.1 General considerations
D.2 Evaluation criteria for components
Table D.1 – Wetting balance parameter and suggested evaluation criteria
D.3 Evaluation criteria for printed boards
Figure D.1 – Set A wetting curve
Figure D.2 – Set B wetting curve
Table D.2 – Printed board test parameter and suggested criteria
Annex E (informative)Method of calculating the maximum theoretical force and integrated value of the area of the wetting curve for leaded non-SMD [Go to Page]
E.1 Method of calculating the maximum theoretical force
E.2 Method of calculating the integrated value of the area of the wetting curve
Bibliography [Go to Page]

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BS EN 60068-2-69:2017 Environmental testing - Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method, 2018

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please select your company type below: