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eLibrary >
23/30423657 DC BS EN IEC 60068-3-14. Environmental testing - Part 3-14. Supporting documentation and guidance. Developing a climatic sequential test >
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23/30423657 DC BS EN IEC 60068-3-14. Environmental testing - Part 3-14. Supporting documentation and guidance. Developing a climatic sequential test, 2023
- 104_1007e_CD.pdf [Go to Page]
- FOREWORD
- INTRODUCTION
- 1 Scope
- 2 Normative references
- 3 Terms and definitions
- 4 Background [Go to Page]
- 4.1 Environmental exposure sequence in life cycle
- 4.2 Failure mechanism under a sequential test
- 5 Introduction to the Process [Go to Page]
- 5.1 General
- 5.2 Stage 1: review environmental requirements and compile a provisional test sequence
- 5.3 Stage 2: establish critical environments and refine sequence
- 5.4 Stage 3: prepare sequential test programme
- 5.5 Overall process
- 6 Stage 1: review requirements compile provisional test sequence [Go to Page]
- 6.1 Evaluate product life cycle [Go to Page]
- 6.1.1 Consideration of the product life cycle should have occurred as part of the exercise to generate the environmental requirements document. The environmental requirements document should reflect the predominant phases of the life cycle. However,...
- 6.1.2 The product life cycle can also be used, to identify whether changes in logistics and operational usage may occur in the future. For example, one type of transport vehicle may be replaced by another. Even when information of future potential e...
- 6.2 Evaluate environmental requirements [Go to Page]
- 6.2.1 The information in the environmental requirements document can be presented in several ways. Whichever approach is used, the logistical and operational requirements should be broken down into their major phases. The phases will differ for eac...
- 6.2.2 For each phase of the logistical and operational requirements identified for particular product, the individual environmental conditions should be specified in detail. Typical environmental conditions, which should be encompassed, are indicat...
- 6.3 Compile provisional list of critical environments
- 7 Stage 2: establish critical environments and refine sequence [Go to Page]
- 7.1 Consideration of the operational state of the product [Go to Page]
- 7.1.1 The preliminary step in the elimination of unnecessary repetition of environmental conditions in the provisional environmental sequence, is achieved by consideration of the various operational states of the product. If the product is in the sa...
- 7.1.2 Similar environmental conditions, but with the product in a different operational state cannot usually be accumulated, unless it can be shown that the environmental conditions have a similar effect on the product.
- 7.1.3 For most product, the relevant states are likely to be; “packaged and non-operating”, “unpackaged and non-operating”, “unpackaged and operating” and “re-packaged and non-operating”. For some product, an intermediate level of packaging may need...
- 7.1.4 Generally if product is non-operating, it will be expected to operate after the applicable environmental conditions but not during. However, if product is operating, it will be expected to meet its operational requirements, during the applicab...
- 7.2 Identification of potential failure modes [Go to Page]
- 7.2.1 Identifying potential failure modes of product is undertaken to allow a sequential order of the priority of environmental conditions to be established. The need to identify potential failure modes is of particular importance, when the environm...
- 7.2.2 Additional advice on some more critical product failure modes is set out in Annex A.
- 7.3 Identify need for combined testing [Go to Page]
- 7.3.1 This stage of the process takes consideration of combined environments conditions. This is specifically relevant where combined testing has the potential to exercise potential failure modes, which would not be adequately exercised, if the envi...
- 7.3.2 Many environmental conditions occur, in conjunction with other environmental conditions. In either case, it is possible for the coincident environmental conditions to have an effect on the product, which is greater than would be the case if th...
- 7.3.3 The process for identifying combined conditions, worthy of consideration, should be based upon the product failure modes, identified in 6.2. These failure modes and associated degradation mechanisms should be reviewed, to identify which would ...
- 7.3.4 It is frequently the case, that in order to undertake combined environmental testing, special test facilities are required. Also testing certain combined conditions, can be difficult and expensive to perform. The following supplies guidance on...
- 7.4 Review sensitivity of product to sequential environmental conditions
- 7.5 Consideration of sequential and non-sequential testing
- 8 Stage 3: prepare sequential test programme [Go to Page]
- 8.1 General
- 8.2 Critical climatic tests
- 8.3 Combined climatic tests
- 8.4 Sequential climatic tests
- 8.5 Review programme for technical credibility and cost effectiveness [Go to Page]
- 8.5.1 The test programme could be at risk if the testing required is novel, unfamiliar or at the extremes of the test facility capabilities. In such cases consideration should be taken to precursor investigations and risk reduction testing, prior t...
- 8.5.2 In many cases cost savings may be achieved by slightly modifying the sequence, to allow effective use of product and time but only if this is technically reliable. Moreover such modifications, should never over-ride the priority order previou...
- Annex A (informative) Failure modes [Go to Page]
- A.1 Introduction [Go to Page]
- A.1.1 A failure mode is a description of the way in which an item of product, or a component of that product, fails. It is therefore, defined by the manner in which the product is judged to have failed. So a condition that would result in the failur...
- A.1.2 The term failure mechanism should not be confused, with the term failure mode. A failure mechanism is the process by which the failure mode is realised. There is also a difference between a failure and a fault: A fault is any lack of conforman...
- A.1.3 In any real system there will be a number of potential failure modes, any of which could be life limiting. The failure modes that are exercised during the life of the system will depend on the environments it experiences during its life cycle....
- A.1.4 Product qualification testing needs to take account of the cumulative effects of the environments in the life cycle. Additionally, a detailed understanding of the failure modes and mechanisms is required, especially if unrealistic failure mode...
- A.1.5 When conducting accelerated testing, knowledge is required of the appropriate failure models, to enable an assessment to be made of the amount of testing to demonstrate the required life. Commonly used models include; the Arrhenius relationshi...
- A.1.6 Ideally failure mechanisms should be designed out of the product or its life cycle, or a preventive maintenance regime could be adopted, to replace the components before failure occurs.
- A.2 Failure modes of electrical and electronic components [Go to Page]
- A.2.1 In recent years a considerable knowledge base has been established concerning the failure and degradation of electrical and electronic components. Moreover, this knowledge base is embedded in a number of modelling tools, which allow the effect...
- A.2.2 The knowledge base concerning the failure and degradation of electrical and electronic components has been developed to improve the reliability of electrical and electronic systems, especially against the environmental loadings of temperature,...
- A.2.3 Temperature is one of the most important environmental parameters related to the reliability and performance of electronics. Temperature influences reaction rates, changes material behaviour, and has the potential to degrade the operational ch...
- A.2.4 Additionally, changes of temperature (i.e. temperature cycling) can significantly reduce reliability. Electronics are composed of many different materials that have wide ranges of thermal expansion coefficients. This wide range of thermal expa...
- A.2.5 Thermal shock, or rapid changes of temperature, may result in warping of surface mounted assemblies resulting in multi-axial tensile overstress and tensile fatigue. This is in contrast to slower rates of temperature cycling, which result in sh...
- A.2.6 The high packing density of modern electronics makes them susceptible, to the effects of contamination occurring during manufacture and use. The result of corrosion is; material loss of conductors, permanent or intermittent loss of continuity ...
- A.2.7 Shock and vibration are common accelerators of failure in electronic packages. The most frequent vibration induced failures are; the flexing of leads and interconnects as well as the dislodging and damage of electrical components and structure...
- A.2.8 Electrical connections, even permanent connections, have been identified as significant source of electrical unreliability in many applications, regardless of the level of technology of the application. Connections may work loose due to vibrat...
- A.3 Failure modes of optics and sensors [Go to Page]
- A.3.1 Optics may be subject to misalignment, loosening, fogging and surface damage as a result of environmental exposure. Generally, looseness in optics is caused by shock from firing, transport, and dropping. The fogging of lenses is usually caused...
- A.3.2 The accuracy, sensitivity and functionality of sensors are commonly influenced by environmental parameters. The sensitivity and the accurate operation of sensors are frequently influenced by temperature, but vibration and shock may also influe...
- A.4 Failure modes of power sources [Go to Page]
- A.4.1 Traditional designs of battery, used for many applications are susceptible to failures resulting from shock, aging, corrosion and temperature extremes. The greatest concern was the drain rate of the battery. High drain rates on batteries and s...
- A.4.2 The use of power sources other than batteries (e.g. fuel cells or turbines) is a relatively new application of technology and so can lead to reliability concerns. One concern is that the power source may be external to the product, making it d... [Go to Page]
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