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eLibrary > BS EN IEC 60115-1:2023 - TC Tracked Changes. Fixed resistors for use in electronic equipment - Generic specification >

BS EN IEC 60115-1:2023 - TC Tracked Changes. Fixed resistors for use in electronic equipment - Generic specification, 2023

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BS EN IEC 60115-1:2023 - TC Tracked Changes. Fixed resistors for use in electronic equipment - Generic specification, 2023

A-30355703.pdf [Go to Page]
undefined
European foreword
11 Addition of Annex ZA
12 Addition of a new Annex ZX
Table ZX.1 — Cross-references for references to clauses
Table ZX.2 — Cross-references for references to figures
Table ZX.3 — Cross reference for references to tables [Go to Page]
English [Go to Page]
CONTENTS
FOREWORD
INTRODUCTION
Figures [Go to Page]
Figure 1 – Hierarchical system of specifications
1 Scope
2 Normative references
3 Terms, definitions, product technologies and product classifications [Go to Page]
3.1 Terms and definitions
Figure 2 – Voltage and dissipation on a resistor below and above its critical resistance
3.2 Product technologies
3.3 Resistor encapsulations
3.4 Product classification
4 General requirements [Go to Page]
4.1 Units and symbols
4.2 Preferred values
4.3 Coding
4.4 Marking of the resistors
4.5 Marking of the packaging
4.6 Ordering designation
4.7 Permissible substitutions
4.8 Packaging
4.9 Storage
4.10 Transportation
5 General provisions for measurements and test methods [Go to Page]
5.1 General
5.2 Standard atmospheric conditions
Tables [Go to Page]
Table 1 – Reference atmospheric conditions
Table 2 – Referee atmospheric conditions
Table 3 – Standard atmospheric conditions for testing
5.3 Tolerances on test severity parameters
Table 4 – Controlled atmospheric conditions for recovery
Table 5 – Default tolerances on temperature specifications
Table 6 – Default tolerances on voltage specifications
5.4 Drying
5.5 Mounting of specimens
Table 7 – Default tolerances on duration specifications
Table 8 – Specimen drying procedures
5.6 Measurement of resistance
Table 9 – Voltages for resistance measurement
Figure 3 – Standard measurement points on a leaded resistor
Figure 4 – Standard measurement points on an SMD resistor
6 Electrical measurements and tests [Go to Page]
6.1 Resistance
Figure 5 – Measurement points on an assembled SMD resistor
Figure 6 – Permissible resistance range due to tolerance
6.2 Temperature coefficient of resistance
Figure 7 – Permissible resistance range due to tolerance and TCR
Figure 8 – Variation of resistance with temperature (example)
Table 10 – Sequence of temperatures and measurements
6.3 Inductance
Figure 9 – Test circuit for measurement of the inductance
6.4 Voltage coefficient of resistance
Figure 10 – Exponential voltage rise caused by inductance
6.5 Nonlinearity
6.6 Current noise
6.7 Temperature rise
7 Endurance tests [Go to Page]
7.1 Endurance at the rated temperature 70 °C
Figure 11 – Standard derating curve for the rated dissipation P70
7.2 Endurance at room temperature
Figure 12 – Derating curve with specification of a suitable test dissipation
Figure 13 – Derating curve without specification of a suitable test dissipation
7.3 Endurance at a maximum temperature
Figure 14 – Derating curve for UCT ≥ MET
Figure 15 – Derating curve for UCT < MET
8 Electrical overload tests [Go to Page]
8.1 Short-term overload
8.2 Single-pulse high-voltage overload test
Figure 16 – Parameters of an open-circuit lightning impulse voltage
Figure 17 – Circuit for generation of 1,2/50 pulses
Figure 18 – Circuit for generation of 10/700 pulses
Table 11 – Severities for the single-pulse high-voltage overload test
8.3 Periodic-pulse high-voltage overload test
8.4 Periodic-pulse overload test
Table 12 – Severities for the periodic-pulse high-voltage overload test
8.5 Electrostatic discharge
9 Mechanical measurements and tests [Go to Page]
9.1 Visual examination
9.2 Gauging of dimensions
9.3 Detail dimensions
9.4 Robustness of the resistor body
9.5 Robustness of terminations
Figure 19 – Testing of resistor body robustness
Table 13 – Tensile test force for wire terminations
9.6 Robustness of threaded stud or screw terminations
Table 14 – Test torque for threaded studs, screws and integral mounting devices
9.7 Shear test
Figure 20 – Shear test for SMD resistors
9.8 Substrate bending test
Table 15 – Recommended parameters for the substrate bending test
Figure 21 – Substrate bending test for SMD resistors
9.9 Bump
9.10 Shock
Table 16 – Recommended parameters for the bump test
9.11 Vibration
Table 17 – Recommended parameters for the shock test
Table 18 – Recommended parameters for the vibration test
10 Environmental and climatic tests [Go to Page]
10.1 Rapid change of temperature
10.2 Operation at low temperature
Table 19 – Recommended parameters for the rapid change of temperature test
10.3 Climatic sequence
Table 20 – Number of additional damp heat cycles
10.4 Damp heat, steady state
Table 21 – Severity parameters for the damp heat, steady state test
Table 22 – Bias voltage for the damp heat, steady state test
10.5 Damp heat, steady state, accelerated
Table 23 – Severity parameters for the accelerated damp heat, steady state test
10.6 Corrosion
Table 24 – Grouped DC bias voltages for < 25 % deviation
Table 25 – Recommended parameters for the corrosion test
10.7 Whisker growth test
10.8 Hydrogen sulphide test
Table 26 – Test methods and parameters for the whisker growth test
11 Tests related to component assembly [Go to Page]
11.1 Solderability
Table 27 – Selection of accelerated ageing methods of IEC 60068-2-20
Table 28 – Process temperatures for selected solder alloy examples
Table 29 – Solderability test parameters for SMD resistors
Table 30 – Solderability test parameters for resistors with wire or tag terminations
11.2 Resistance to soldering heat
Table 31 – Resistance to soldering heat test parameters for SMD resistors
Table 32 – RSH test parameters for resistors with wire or tag terminations
11.3 Solvent resistance
12 Tests related to safety [Go to Page]
12.1 Insulation resistance
Table 33 – Recommended parameters for the solvent resistance test
Figure 22 – V-block fixture
Figure 23 – Foil method applied to a resistor specimen
Figure 24 – Mounting method applied to a resistor specimen
Figure 25 – Parallel clamp fixture for rectangular SMD resistors
Figure 26 – V-clamp test fixture for cylindrical SMD resistors
12.2 Voltage proof
Table 34 – Insulation resistance measuring voltage
12.3 Accidental overload test
Figure 27 – Gauze fixture for axial cylindrical specimens
Figure 28 – Gauze fixture dimensions for cylindrical specimens
Figure 29 – Gauze fixture dimensions for non-cylindrical specimens
12.4 Flammability
Table 35 – Recommended parameters for the accidental overload test
13 Quality assessment procedures
Annexes [Go to Page]
Annex A (normative) Symbols and abbreviated terms
Annex B (normative) Rules for the preparation of detail specifications for resistors and capacitors for electronic equipment for use within the IECQ system
Annex C (informative) Example of a certified test record
Annex Q (informative) Quality assessment procedures [Go to Page]
Q.1 General
Q.2 IECQ Approved Component (IECQ AC) procedures
Q.3 IECQ Qualification Approval (QA) procedures
Q.4 IECQ Approved Component – Capability Certification (IECQ AC-C) procedures
Q.5 IECQ Approved Component – Technology Certification (IECQ AC-TC) procedure
Annex R (informative) Failure rate level evaluation, determination and qualification [Go to Page]
R.1 General
R.2 Certification and determination of a failure rate level
Table R.1 – Requirements for the qualification of a failure rate level [Go to Page]
R.3 Non-conformances
R.4 Extension of a qualification to a higher failure rate level
R.5 Maintenance of a failure rate level
R.6 Deliveries
Table R.2 – Requirements for the maintenance of a failure rate level qualification [Go to Page]
R.7 Determination of a component failure rate
Table R.3 – Environmental factor πE for determination of the component failure rate
Table R.4 – Quality factor πQ for determination of the component failure rate
Annex X (informative)Cross-references for references to the prior revision of this document
Table X.1 – Cross-references for references to clauses (1 of 3)
Bibliography [Go to Page]

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BS EN IEC 60115-1:2023 - TC Tracked Changes. Fixed resistors for use in electronic equipment - Generic specification, 2023

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