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eLibrary > PD IEC/TS 62647-23:2013 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder - Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies >

PD IEC/TS 62647-23:2013 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder - Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies, 2013

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PD IEC/TS 62647-23:2013 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder - Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies, 2013

30291838.pdf [Go to Page]
CONTENTS
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and abbreviations [Go to Page]
3.1 Terms and definitions
3.2 Abbreviations
4 Pb-free concerns [Go to Page]
4.1 General
4.2 Reliability [Go to Page]
4.2.1 General
4.2.2 Mixed metallurgy reliability
4.3 Configuration management
4.4 Risk management
4.5 Tin whiskers
4.6 Copper dissolution (erosion)
5 Materials [Go to Page]
5.1 Solder [Go to Page]
5.1.1 General
5.1.2 Solder alloys
5.1.3 Solder forms
5.2 Fluxes
5.3 Piece parts [Go to Page]
5.3.1 General
5.3.2 Termination finishes
5.3.3 Area arrays (BGA, CSP, etc.)
5.4 Printed circuit boards/printed wiring boards [Go to Page]
5.4.1 Laminate material
5.4.2 Surface finish
5.5 Conformal coatings
6 Soldering equipment [Go to Page]
6.1 General
6.2 Hand soldering equipment [Go to Page]
6.2.1 General hand soldering equipment considerations
6.2.2 Tip selection
6.2.3 Soldering iron tip life
6.3 Fountain soldering
6.4 Convective soldering equipment [Go to Page]
6.4.1 General
6.4.2 Thermal profile issues
7 General rework/repair considerations [Go to Page]
7.1 General
7.2 Rework/repair procedure order of precedence
7.3 Technician training
7.4 Pb-free rework/repair considerations [Go to Page]
7.4.1 General
7.4.2 General process considerations
7.4.3 Solder processing considerations
7.4.4 Flux considerations
8 Pre-rework/repair processes [Go to Page]
8.1 Alloy identification [Go to Page]
8.1.1 IPC/JEDEC J-STD-609A
8.1.2 X-ray fluorescence (XRF)
8.1.3 Pb swabs
8.2 Piece part and CCA preparation [Go to Page]
8.2.1 General
8.2.2 Piece part preparation
8.2.3 CCA preparation
9 Rework/repair processes [Go to Page]
9.1 General
9.2 Conductive hand soldering
9.3 Convective soldering process [Go to Page]
9.3.1 General
9.3.2 Solder paste handling
9.3.3 Paste printing
9.3.4 Reflow process
10 Post-rework/repair processes [Go to Page]
10.1 Cleaning
10.2 Inspection
10.3 Reapplication of conformal coating
Annex A (informative) Termination finishes
Annex B (informative) Tin whiskers
Bibliography
Figures [Go to Page]
Figure 1 – Soldering iron tip construction
Figure 2 – Worn soldering iron tip
Figure 3 – Copper dissolution
Tables [Go to Page]
Table 1 – Assembly and piece part marking methods
Table A.1 – Piece-part terminal and BGA ball metallization solder process compatibility risk (see IEC/TS 62647-22:2013)
Table A.2 – BGA piece parts risk
Table B.1 – Tin whisker information (see IEC/TS 62647-22:2013)
Table B.2 – Piece part termination tin whisker risks(see IEC/TS 62647-22:2013) [Go to Page]

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PD IEC/TS 62647-23:2013 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder - Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies, 2013

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please select your company type below: